Murata Manufacturing Co., Ltd.

Hidefumi Nakanishi

Koichiro Kawasaki

Yukio Yoshino

Atsushi Sakurai

Masato Kobayashi

Kazunori Inoue

Masahiro Fukushima

Shintaro Otsuka

Masakazu Atarashi

Yutaka Sasaki

Hiroaki Tanaka

Yasuyuki Toyota

An electronic component includes a substrate, a functional element on the substrate, a first electrode, a support body that is made of an insulator, a cover portion, a second electrode, and a projection. The first electrode is located on the substrate and connected to the functional element. The support body protrudes from the substrate and covers the first electrode. The cover portion opposes the substrate, and a hollow space is defined by the substrate, the support body, and the cover portion. The second electrode is located in a via hole extending through the support body and the cover portion and electrically connected to the first electrode. The projection is located on the first electrode in the via hole.

Electronic component and method of manufacturing electronic component

An electronic component includes a substrate, a functional element on the substrate, a support body, a covering portion, and a protective layer covering the covering portion. The support body is provided on the substrate and around a region in which the functional element is located. The covering portion faces the substrate and is supported by the support body. The substrate, the support body, and the covering portion define a hollow space. The functional element is located in the hollow space. In the support body, a surface opposite to a surface facing the substrate is a first surface, and a portion of the protective layer is in contact with the first surface of the support body without the covering portion being interposed.

Electronic component including protective layer

By using a dual ion-beam sputtering apparatus, an aluminum thin-film is formed on a glass substrate made of an amorphous material. While radiating an ion beam for assisting the film formation from an ion source onto the glass substrate, the aluminum thin-film is formed by depositing the sputtering ions which are generated by radiating an ion beam onto an aluminum target.

Metallic thin film and method of manufacturing the same, and surface acoustic wave device using the method thereof

Metallic thin flim and method of manufacturing the same, and surface

In a coupled line, microstrip lines are formed so as to be arranged with a spacing that is narrower than the smallest possible space that is obtainable with a conventional electrode forming process, on a top side thereof spaced away from a dielectric substrate. The microstriplines have a trapezoid-shaped cross-section with the narrower major surface at the bottom, in contact with the dielectric substrate. Such formation makes it possible to strengthen the coupling between the microstrip lines, and to reduce the conductor loss of the microstrip lines.

Coupled microstrip lines

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Shiga-ken, Japan

Hidefumi Nakanishi