Nagano Keiki Co., Ltd.

Hidebumi Seki

Tomohiro Rokugawa

Hiroyuki Sakai

Hiroyuki Toba

Toshiaki Kobayashi

Yasuhisa Tanaka

Hideki Muramatsu

Yuri Sugahara

A physical quantity measuring device includes a cylindrical case provided with a through hole, a sensor module, a joint, a cap member, a circuit board including an electronic circuit and an electronic adjuster, a sealing member attached to the through hole, and an adjuster member capable of adjusting the electronic adjuster. The electronic adjuster includes an engaged portion disposed to face the through hole. The sealing member is provided with a housing recess opened to an outside of the cylindrical case, and a communication hole for bringing the housing recess into communication with an interior of the cylindrical case. The adjuster member includes a shaft that is hermetically attached in the communication hole, an engagement portion provided at a first end of the shaft to be engageable with the engaged portion, and an operable portion provided at a second end of the shaft and housed in the housing recess.

Physical quantity measuring device

A circuit board including an electronic circuit unit and electronic adjusting units is disposed in a case. A signal transmitting member connected to the circuit board is mounted in a mount hole of a cover member. Operation holes corresponding to a plurality of operable portions of the electronic adjusting units are provided to the cover member. A cap member including a plurality of cap bodies and a connection portion connecting the cap bodies is attached to the cover member to close the operation holes. The operation holes for adjusting the electronic adjusting units are thus covered/uncovered by the simple cap member. The operation holes are reliably waterproofed by the cap member.

Physical quantity measuring device and method of manufacturing the same

A plate-shaped circuit board configured to receive a detection signal from a detector is housed in a case and is held by a holder with a flat substrate surface thereof intersecting with a bottom surface of a cover member. The holder is attached to the cover member. The cover member includes a cover body, and elongated supporting portions projecting from the bottom surface of the cover body into the case. The supporting portions each include a pair of support projections that support one of opposite side surfaces of the circuit board along a projecting direction of the supporting portions. The holder includes a flat portion provided with engagement pieces engageable with a second substrate.

A pressure display apparatus that includes a detected signal processor for processing a detected signal Si obtained from a pressure detector for detecting a pressure P, a pressure value display for displaying a detected pressure value Pd at least based on a processed signal Dd obtained from the detected signal processor, and a reference point adjuster for adjusting the display for a given reference pressure value Ps. The reference point adjuster has a reference pressure value setting function to set the reference pressure value Ps for a given magnitude, a deviation value setting capability for obtaining and setting a detected pressure value Pd corresponding to the reference pressure value Ps and the deviation value Ed of the reference pressure value Ps, and a correction capability for correcting at least the detected pressure value Pd regarding the pressure P and displayed on the display based on the deviation Ed.

Pressure display apparatus

A detector () includes: a joint () mounted on a fluid pipe; a case () mounted on the joint () to house a sensor (); a holder () attached to the case () and housing a circuit board (); and a cover () attached to the holder () and integrated with a light-shielding plate (). An annular first lug (), a leaf spring () having a projection () and a rotation restrainer which projects further from the first lug () along an inner circumferential side thereof are integrally formed on the holder (). An annular first recess () to be engaged with the first lug () is formed on the case (). A groove () is formed on an inner surface of the first recess. An annular second recess () is provided on an inner circumferential side of the first recess (). A riser portion () is provided to a bottom surface thereof.

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Tokyo, Japan

Hidebumi Seki