Mitsubishi Kinzoku Kabushiki Kaisha

Fujitsu Corporation

Hideaki Yoshida

Masaki Morikawa

Kunio Kishida

Naoyuki Hosoda

Naoki Uchiyama

Chuji Tanaka

Toshiaki Ono

Hitoshi Saito

Kenichi Utsumi

Takahisa Miyamoto

Toshihito Kanetsuku

Osamu Ohmori

Yutaka Sugai

Yuji Munakata

Yukimasa Yoshida

Takafumi Kawashima

Tomoaki Kaneda

A communication device calculates a signal travelling time indicating a time period from a first time at which the signal has been transmitted from the communication device, to a second time at which the transmitted signal is expected to arrive at another communication device serving as a communication partner. The communication device retransmits the signal to the another communication device when a retransmission request of the signal is received from the another communication device after the signal has been transmitted to the another communication device, and suspends a retransmission of the signal when the retransmission request is received again from the another communication device before the signal travelling time elapses from the first time.

Apparatus and method for performing efficient retransmission

When a first MS control signalling device that controls a mobile station fails, a second MS control signalling device takes over the processing of the first MS control signalling device. The second MS control signalling device requests a RLC parameter necessary for communication of the mobile station, and the mobile station transmits the requested RLC parameter to the second MS control signalling device. The second MS control signalling device controls communication of the mobile station, using the obtained RLC parameter. A data path for transmitting user data of the mobile station is not released but is held when the MS control signalling devices are switched.

Recovery method and radio network controller in radio communication system

The present invention relates to a library apparatus capable of enhancing the coupling accuracy and the positioning accuracy among a plurality of lockers to bring up the traveling accuracy and positional accuracy of an accessor within a passage penetrating the lockers so that the accessor can surely accomplish the insertion/extraction of a cartridge into/from a storage rack or a deck. For this purpose, a supporting member which holds a rail for guiding the accessor along a direction of coupling the plurality of lockers within the passage is installed in the coupling direction for each of the lockers, and a positioning groove in which a bar-like tool is fitted when positioning the adjacent lockers with respect to each other is made in an end portion of the supporting member in the coupling direction. This invention is applicable to a large-capacity external memory system storing a large number of cartridges such as magnetic tape cartridges and optical disk cartridges.

Library apparatus for disc cartridge

The present invention eliminates the problems associated with the use of oxygen-free copper and other high-purity copper materials as bonding wires. In accordance with one aspect of the present invention, at least one rare earth element, or at least one element selected from the group consisting of Mg, Ca, Ti, Zr, Hf, Li, Na, K, Rb and Cs, or the combination of at least one rare earth element and at least one elemented selected from the above-specified group is incorporated in high-purity copper as a refining component in an amount of 0.1-100 ppm on a weight basis, and the high-purity copper is subsequently refined by zone melting. The very fine wire drawn from the so refined high-purity copper has the advantage that it can be employed in high-speed ball bonding of a semiconductor chip with a minimum chance of damaging the bonding pad on the chip by the ball forming at the tip of the wire. In accordance with another aspect of the present invention, 0.5-3 ppm of a rare earth element and/or Y is further incorporated as an alloying component in the zone-refined high-purity copper.

Wire for bonding a semiconductor device

The present invention eliminates the problems associated with the use of oxygen-free copper and other high-purity copper materials as bonding wires. At least one rare earth element, or at least one element selected from the group consisting of Mg, Ca, Ti, Zr, Hf, Li, Na, K, Rb and Cs, or the combination of at least one rare earth element and at least one elemented selected from the above-specified group is incorporated in high-purity copper as a refining component in an amount of 0.1-100 ppm on a weight basis, and the high-purity copper is subsequently refined by zone melting. The very fine wire drawn from the so refined high-purity copper has the advantage that it can be employed in high-speed ball bonding of a semiconductor chip with a minimum chance of damaging the bonding pad on the chip by the ball forming at the tip of the wire.

Wire for bonding a semiconductor device and process for producing the

A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed is a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.

Copper alloy having high resistance to oxidation for use in leads on

A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed in a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.

Growing community of inventors

Kasukabe, Japan

Hideaki Yoshida