Sekisui Chemical Co., Ltd.

Tokuyama Sekisui Co., Ltd.

Sekisui Chemical Hokkaido Co., Ltd.

Hideaki Yano

Kazuhiro Okada

Michio Shimamoto

Shingo Miyata

Kenichi Matsumura

Ryota Yamasugi

Masaki Tono

Toshitaka Yoshitake

Akira Ueda

Katsuhiro Nakazato

Kenji Otsuka

This invention relates to a thermally expandable fire-resistant resin composition comprising a resin component in an amount of 100 parts by weight, thermally expandable graphite in an amount of 3 to 300 parts by weight, and an inorganic filler in an amount of 2 to 200 parts by weight, wherein the thermally expandable graphite has an average aspect ratio of 20 or more.

Thermally expandable fire resistant resin composition

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40.

Thermal expansion resin composition

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99.

Thermally expandable resin composition

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Hasuda, Japan

Hideaki Yano