Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Hideaki Watanabe

Dai Yokoyama

Kiyoshi Imai

Shigeki Imafuku

Hiromi Kinoshita

Yosuke Nagasawa

Yuzuru Inaba

Toshiyuki Koyama

Taira Ishii

Akira Kabeshita

Noriaki Yoshida

Yoshihiko Misawa

Takeyuki Kawase

Naoto Mimura

Tetsutarou Hachimura

Kian Hong Lam

Toshiro Nishiwaki

Kazuo Nagae

Mitsuo Kawate

Yew Song Danny Ng

Satoshi Matsuoka

Yet Ling Loh

Jintao Huang

A component supply device includes a transport path that guides a component connected body from a component insertion port on an upstream side in a component feeding direction to a component supply position on a downstream side, the component connected body including a plurality of axial components arranged and connected at a predetermined pitch, the plurality of axial components each having a lead, and a feed mechanism that pitch-feeds the component connected body along the transport path to the downstream side. The feed mechanism includes a feed member which has a plurality of feed hooks disposed at the predetermined pitch along the component feeding direction, a rotating shaft which is connected to one end side of the feed member, and a moving mechanism which is connected to the feed member through the rotating shaft and reciprocates the rotating shaft along the component feeding direction. A length of one feed hook among the plurality of feed hooks is longer than a length of an other feed hook among the plurality of feed hooks, the other feed hook being adjacent to the one feed hook on the rotating shaft side.

Component supply device and component mounting device

A method of mounting a component includes an approaching step of causing the pair of clamping members to approach each other with the first body of the first component disposed between the paired clamping members, a clamping step of clamping the first component, and a mounting step of moving the pair of clamping members clamping the first component to the substrate and pressing out the first component clamped by the pair of clamping members with the pusher for mounting on the substrate, when the clamping members mount the first component on the substrate.

Method of mounting component

A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.

Method of manufacturing component-mounted substrate

A component mounting device mounting a component on a substrate comprises a pair of opening/closing members opening and closing, and a plurality of adapters detachably attached to the opening/closing members; the adapters are attached to the opening/closing members depending on the component to be mounted so as to clamp the component by using the adapters; and the plurality of adapters includes first adapters each having a flat clamping surface clamping a body of the component and second adapters each having a holding groove holding an axial portion of the component.

Component mounting device and method of mounting component

A component mounting apparatus for mounting a component on a substrate includes a pair of chuck claws that sandwich and grip the component; and adapters that are detachably mounted on the chuck claws and grip the component in place of the chuck claws. The adapters are mounted on the chuck claws in accordance with the component that is an object to be mounted and the component is gripped by using the adapters.

Component mounting apparatus

A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.

Electronic component mounting method and electronic component mounting apparatus

A component supply device includes a posture maintainer and a pair of cutting members. The posture maintainer includes a pair of grip members, each of which includes a tip end portion that extends in a traveling direction of a component holding tape. The posture maintainer maintains the posture of a component by gripping a body portion of the component having been supplied to a component supply position with the body portion interposed between the tip end portions of the pair of the grip members. The pair of cutting members cuts a lead portion of the component having been gripped by the pair of grip members with the lead portion interposed between the pair of cutting members in a direction intersecting a traveling direction of the component holding tape.

Component supply device, component mounter, and component-mounted board manufacturing method

An insertion head includes: a horizontal shaft member; one pair of gripping claws, extending on a surface orthogonal to the horizontal shaft member; one pair of gripping claw holding members movable on the horizontal shaft member which hold the one pair of gripping claws; a swing mechanism which rotates and drives the shaft member, and swings the one pair of gripping claw holding members around a center axis of the shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the shaft member and changes an interval between the one pair of gripping claws. The gripping claw extends to be bent on the surface, and each straight line portion of each tip end is offset to a perpendicular axis extending on the surface through a center axis of the shaft member in a posture of being oriented downward.

Insertion head, component insertion device, and component mounting line

An insertion head includes: a horizontal shaft member; one pair of gripping claws, each gripping claw extending on a surface which is orthogonal to the horizontal shaft member; one pair of gripping claw holding members which are provided to be movable on the horizontal shaft member, and hold the one pair of gripping claws; a swing mechanism which rotates and drives the horizontal shaft member, and swings the one pair of gripping claw holding members around a center axis of the horizontal shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the horizontal shaft member and changes an interval between the one pair of gripping claws. A leaded component is gripped with the one pair of gripping claws, and a lead of the leaded component is inserted into an insertion hole on a printed circuit board.

There is provided an electronic component mounter configured to include a supplier holder in which a radial lead type electronic component supplier can be mounted, and to cause a mounting head to hold a radial lead type electronic component so as to mount the component on a board positioned by a board holder. The electronic component mounter includes a tape guide passage that guides a tape body after the radial lead type electronic components are picked up from the tape body. The electronic component supplier is configured to further include a posture converter that converts a posture of the tape body from a posture perpendicular to a horizontal plane to a posture parallel to the horizontal plane, after the radial lead type electronic components are picked up from the tape body, and that introduces the tape body to the tape guide passage.

Electronic component mounter

Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

Method for mounting electronic component

An insertion head includes: a horizontal shaft member; one pair of gripping claws, each gripping claw extending on a surface which is orthogonal to the horizontal shaft member; one pair of gripping claw holding members which are provided to be movable on the horizontal shaft member, and hold the one pair of gripping claws; a swing mechanism which rotates and drives the horizontal shaft member, and swings the one pair of gripping claw holding members around a center axis of the horizontal shaft member; and an interval changing mechanism which moves the one pair of gripping claw holding members on the horizontal shaft member and changes an interval between the one pair of gripping claws. A gripping force of the leaded component by the one pair of gripping claws is changed by performing an interval changing control of the one pair of gripping claws via the interval changing mechanism.

Insertion head for leaded component

Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

Apparatus for mounting electronic component

A component supplying apparatus includes a chute section including a sliding surface on which an electronic component is slidable. The chute section includes: a pair of bottom support members which oppose each other in a lateral direction perpendicular to a sliding direction such that a distance between the bottom support members is changeable, and each of which includes an upper surface defining the sliding surface; a pair of side support members which oppose each other in the lateral direction such that a distance between the side support members is changeable, and which support lateral side surfaces of the electronic component sliding on the sliding surface; and a top support member which opposes the sliding surface such that a distance between the top support member and the sliding surface is changeable, and which prevents the electronic component sliding on the sliding surface from escaping upward.

Component supplying apparatus

An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.

Growing community of inventors

Yamanashi, Japan

Hideaki Watanabe