Fujikura Limited

Hideaki Usuda

Takeshi Ishizuka

Kenichi Ishibashi

Yoshinobu Numasawa

Daisuke Murakami

Shingo Ishii

Hideo Shiratani

Takao Sato

Takahiro Shimono

Wataru Oishi

Kenichi Nakatate

Masanobu Saruta

Kazuhiro Domoto

An imaging module of the invention includes: an imaging element; and a substrate positioned on a rear surface opposite to an imaging surface of the imaging element and provided to extend from the rear surface to a side opposite to the imaging surface. An electrode pad provided on the rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate at a position close to the imaging element are electrically connected via a conductive connecting material portion. A notch portion recessed from a distal end of the front end portion is formed at the front end portion of the electrode pad of the substrate.

Imaging module and method of manufacturing the same

An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.

Endoscope imaging module with signal cable and flexible linear structure

The imaging module includes: an image-sensing device, circuit substrate, fixing member, signal cable, and electroconductive member. The image-sensing device includes: a connection electrode. The circuit substrate includes: a substrate main body, electrode terminal, cable terminal, and connection wiring. The substrate main body has two surfaces and is an insulating member. The electrode terminal is on the first surface and is electrically connected to the connection electrode. The cable terminal is on the second surface. Inside the substrate main body, the connection wiring electrically connects the electrode terminal to the cable terminal. The fixing member has a through hole and a substrate connection face opposite the second surface. The signal cable is inserted into the through hole and is fixed by the fixing member. The electroconductive member connects the second surface to the substrate connection face and electrically connects the conductor end face to the cable terminal.

Small, solid-state imaging module and harness unit

An imaging module of the invention includes: an image-sensing unit that includes an image-sensing device; a lens that has a front end and is optically connected to the image-sensing device; and a frame that is fixed in position with respect to the image-sensing device and includes a lens barrel having an insertion space, into which the front end is to be inserted in at least an optical axis direction. In a state where movement of the lens in a direction intersecting with the optical axis direction is limited, the insertion space is capable of receiving the lens in the direction such that the lens approaches the image-sensing device. The lens is fixed to the lens barrel at a position at which the lens is optically connected to the image-sensing device.

Imaging module, endoscope, and method of manufacturing imaging module

Imaging module for an endoscope

An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.

Imaging module and imaging-module-attached catheter

An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.

An imaging module of the invention includes: a connector including: a first implanted conductor; a second implanted conductor longer than the first implanted conductor; a first groove that includes a second mounting terminal constituting part of the first implanted conductor; a second groove that includes a third mounting terminal constituting part of the second implanted conductor; and a third groove that is located between the first groove and the second groove; and a coaxial cable including: an internal conductor that is provided in the first groove and is electrically connected to the second mounting terminal; a sheath conductor that is provided in the second groove and is electrically connected to the third mounting terminal; and a coated portion that is provided in the third groove.

Imaging module and endoscope

An imaging module of the invention includes: a solid-state image sensing device including an imaging-device terminal; a connector having a first end face, a second end face located opposite to the first end face, and a side face orthogonal to the first end face, the connector including: a main body serving as an insulating member, an implanted conductor that is implanted in an inside of the main body, a first mounting terminal that is electrically connected to the imaging-device terminal and the implanted conductor and is provided on the first end face, a second mounting terminal that is provided on the side face and constitutes part of the implanted conductor, and a third mounting terminal that is provided on the second end face and constitutes part of the implanted conductor; and a signal cable electrically connected to the second mounting terminal.

Growing community of inventors

Tokyo, Japan

Hideaki Usuda