Sumitomo Electric Industries, Limited

Hideaki Toshioka

Hideki Kashihara

Masamichi Yamamoto

Keiji Koyama

Masatoshi Majima

Tetsuya Kuwabara

Jun Yorita

Takashi Sakai

Masahiro Adachi

Shinji Inazawa

Wataru Sakurai

Mitsuaki Tamura

Yasuhiro Okuda

Hideki Matsubara

Kyouichirou Nakatsugi

Toshihiro Sakamoto

Kazuhiro Kawabata

Yoshie Tani

Misako Osoegawa

An object is to obtain a module in which an optical fiber can be inserted after a ferrule has been mounted on a circuit board. There is provided an optical module () in which at least a ferrule () and an electric component () are mounted on a circuit board () on which external electrodes () have been mounted; a fiber through-hole is formed in the ferrule () in a position in which the optoelectric conversion device () is mounted on one end surface and that corresponds to an active layer of an optoelectric conversion device (); and the optoelectric conversion device () of the ferrule () is electrically connected to the electric component (). In the ferrule (), an opening in the one end face of the fiber through-hole that faces the optoelectric conversion device () is blocked by a transparent substance (), and a portion that excludes the fiber through-hole at the other end surface is are monolithically covered with a molding resin ().

Optoelectric conversion module, method for assembling same, and optoelectric information processor using same

A process for production of a chain metal powder, which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.

Process for production of chain metal powders, chain metal powers produced thereby, and anisotropic conductive film formed by using the powders

A chain metal powder, which is free from branches and has a small distribution of the chain length, can be produced by a process of reducing metal ions contained in an aqueous solution, while applying a magnetic field to the solution containing ferromagnetic ions, in the presence of a polymer compound comprising repeating units of the formula (1): and repeating unit of the formula (2): or repeating unit of the formula (4); or a process which comprises the steps of reducing metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas during the reduction of metal ions and a foamable water soluble compound, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating the bubble layer formed on the surface of the aqueous solution from the solution, and collecting the chain metal powder contained in the bubble layer.

Process for production of chain metal powders, chain metal powders produced thereby, and anisotropic conductive film formed using the powders

An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66&#xb0; C. to 100&#xb0; C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.

Anisotropic conductive adhesive

A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.

Circuit connecting adhesive

An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 &#x3bc;m-20 &#x3bc;m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

Anisotropic conductive film and method for producing the same

A method of producing a fine metal component where a plated coating is deposited on a conductive film exposed at fine through-hole pattern portions in a mold to produce a fine metal component, wherein the conductive film is made using a conductive paste comprised of a metal powder in which the metal particles are magnetically linked together in a chain shape.

Growing community of inventors

Osaka, Japan

Hideaki Toshioka