Toshiba Kikai Kabushiki Kaisha

Hideaki Tobita

Harumichi Tokuyama

Keisuke Mori

A mold clamping apparatus according to the present invention includes: a fixed platen to which one mold of a pair of molds is to be mounted; a movable platen which is disposed opposite the fixed platen and to which the other mold is to be mounted; a pressure-receiving platen connected to the fixed platen via tie bars; a mold opening/closing mechanism including a toggle link mechanism for opening/closing and clamping the molds by moving the movable platen back and forth; a drive mechanism including a servo motor for driving the mold opening/closing mechanism; and a control device for controlling the servo motor, wherein the control device includes an acceleration/deceleration adjustment section capable of adjusting an acceleration time, a deceleration time and a target speed of the servo motor during a mold clamping operation.

Mold clamping apparatrus, molding apparatus and molding method

A mold fastening device has a fixed die plate, a rear plate, a movable die plate that can move back and forth, a toggle mechanism, and a drive motor that drives a cross-head. The position where the cross-head should be stopped is associated with the rate at which to accelerate the cross-head from that position or the rate at which to decelerate the cross-head to that position. The cross-head is operated at an acceleration that corresponds to that position. The drive motor is thereby driven at a constant output torque, regardless of the position of the movable die plate. Further, the time for opening and closing metal molds can be shortened.

Growing community of inventors

Numazu, Japan

Hideaki Tobita