Jsr Corporation

Other

Dsm IP Assets B.v.

Dsm N.v.

Japan Fine Coatings Co. Ltd.

Sharp Corporation

Tokyo Institute of Technology

Japan Fine Coatinss Co., Ltd.

Hideaki Takase

Takashi Ukachi

Yuuichi Eriyama

Takayoshi Tanabe

Yoshikazu Yamaguchi

Tomohiro Utaka

Kentarou Tamaki

Takashi Ochi

Yasuhiro Nakamura

Katsuhiro Kikuchi

Masakazu Shibasaki

Mitsuru Ueda

Zen Komiya

Tsuyoshi Watanabe

Shinji Ando

Yuichi Eriyama

Hideyuki Fujiwara

Mitsuhito Suwa

Keisuke Kuriyama

Yuichi Haruta

Masashi Arai

Toshihiko Takahashi

Masaaki Hanamura

Kentaro Usui

Daigo Ichinohe

Yuichi Takehana

Shuichi Sugawara

Kenichi Hamada

Jun Huangfu

Jirou Ueda

Jin-gang Liu

Ryoji Furuta

Yuzi Shibasaki

Tatsuro Kato

Miwa Ariyuki

Megumi Murata

Shinji Ohba

Hiroki Nakajima

The present invention relates to a radiation sensitive resin composition comprising [A] an alkali-soluble resin, [B] a 1,2-quinonediazide compound and [C] a radical trapping agent. The radiation sensitive resin composition can provide an interlayer insulating film which satisfies general requirements for an interlayer insulating film such as high light transmittance and has excellent heat-resistant dimensional stability, heat discoloration resistance and adhesion to a substrate along with the improvement of process efficiency for improving product yield at a high resolution and has excellent storage stability.

Radiation sensitive resin composition and method of forming an interlayer insulating film

The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole. 

Positive-type radiation-sensitive composition, cured film, interlayer insulating film, method of forming interlayer insulating film, display device, and siloxane polymer for forming interlayer insulating film

It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein Ris independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.

Resin composition, cured product and optical parts

A radiation-sensitive resin composition for forming optical waveguides, which comprises (A) a novolac type epoxy resin and (B) a photo-acid generator. The composition is used as materials for a core portionof an optical waveguide, and the like. In the composition, component (A) is represented by the following general formula (1). (In the formula, Ris a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aralkyl group; and n is an integer from 0 to 10.) The composition is excellent in patterning properties and the like in curing process, and is also excellent in heat resistance, transmission characteristics, and long-term reliability after the optical waveguide has been formed.

Photosensitive resin composition for optical waveguide formation and optical waveguide

A photosensitive resin composition for optical waveguide formation, comprising: (wherein Ris &#x2014;(OCHCH)&#x2014;, &#x2014;(OCH(CH)CH)&#x2014;, or &#x2014;OCHCH(OH)CH&#x2014;; X is &#x2014;C(CH)&#x2014;, &#x2014;CH&#x2014;, &#x2014;O&#x2014;, or &#x2014;SO&#x2014;; Y is a hydrogen atom or a halogen atom; m is an integer of 0 to 4); (wherein Ris &#x2014;(OCHCH)&#x2014;, &#x2014;(OCH(CH)CH)&#x2014;, or &#x2014;OCHCH(OH)CH&#x2014;; Y is a hydrogen atom, a halogen atom, Ph-C(CH)&#x2014;, Ph-, or an alkyl group having 1 to 20 carbon atoms; p is an integer of 0 to 4; Ph is a phenyl group); and

An optical waveguide chip including a core portion as an optical waveguide, a clad portion composed of a lower clad layer and an upper clad layer, and an optical fiber guide portion which is formed integrally with the clad portion for positioning a single-mode optical fiber which is to be connected with the core portion. Each portion of the optical waveguide chip is formed by creating a layer of a radiation-sensitive polysiloxane composition by photolithography. At least two kinds of radiation-sensitive polysiloxane compositions are used so that the core portion has a higher refractive index than the clad portion.

Optical waveguide chip and optical component comprising same

A radiation-curable composition containing (A) hydrolyzates of hydrolyzable silane compounds represented by general formula (1): (R)(R)Si(X)(wherein Ris a non-hydrolyzable organic group having 1 to 12 carbon atoms that contains fluorine atoms, Ris a non-hydrolyzable organic group having 1 to 12 carbon atoms (but excluding ones that contain fluorine atoms), X is a hydrolyzable group, p is an integer of 1 or 2, and q is an integer of 0 or 1) and condensates of such hydrolyzates, and (B) a photo acid generator, wherein the ratio of silanol (Si&#x2014;OH) groups in the composition is 0.1 to 0.5 out of all the bonding groups on Si. With such a composition, the waveguide loss is low for light having a wavelength in a broad range from the visible region to the near infrared region, and moreover the cracking resistance, the patterning ability upon irradiation with radiation, and so on are excellent.

Radiation-curable composition, optical waveguide and method for formation thereof

To provide a radiation-sensitive curable liquid resin composition having excellent applicability and capable of producing a film excelling in hardness, scratch resistance, adhesion, transparency, and appearance of the surface of the film. A curable liquid resin composition comprising: (A) particles prepared by bonding at least one oxide of an element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium to a specific organic compound which comprises a polymerizable unsaturated group and a group shown by &#x2014;X&#x2014;C(&#x2550;Y)&#x2014;NH&#x2014; (wherein X is NH, O, or S, and Y is O or S), and preferably a silanol group, (B) a compound having two or more polymerizable unsaturated groups in the molecule, (C) a specific alkylene glycol organic solvent, and preferably (D) a polymerization initiator.

Curable liquid resin composition

The invention relates to a curable resin composition, cured products thereof, and laminated materials. The curable composition comprises: After cure, the composition has excellent scratch resistance. In addition, it may have excellent antistatic characteristics and transparency. In a preferred embodiment the composition also comprises (A-2) particles other than the acicular particles (A-1), being oxide of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium.

Curable composition, cured product thereof, and laminated material

Photocurable resin composition and optical parts

A photocurable resin composition which comprises (A) a urethane (meth)acrylate oligomer obtained by the reaction of (a) at least one polyol compound preferably selected from the group consisting of polyester polyols and polycarbonate polyols, (b) a polyisocyanate compound, and (c) a hydroxyl group-containing (meth)acrylate compound; (B) a (meth)acrylolylphosphate; (C) a multifunctional (meth)acrylate compound; and (D) a photopolymerization initiator and, optionally, (E) an organosilyl-containing mercapto compound. The composition exhibits a fast cure speed, and the cured products obtained from the composition exhibit superior adhesion under high temperature-high humidity conditions and metal corrosion properties.

Photocurable adhesive for optical disk

Process for the manufacture of a mold for making products from fibrous materials by performing a combination of steps of

Resin composition and fibrous material forming mold

Provided is an optical glass fiber coating composition which when coated on an optical glass fiber and suitably cured provides a coating having the combination of properties (i) through (iv):

Optical glass fiber coating composition

Growing community of inventors

Tokyo, Japan

Hideaki Takase