Fuji Electric Co., Ltd.

Hideaki Takahashi

Kenshi Terashima

Tatsuya Karasawa

Masahiro Taoka

Satoru Motohashi

Yo Sakamoto

Tomofumi Oose

Satoshi Sawayanagi

A semiconductor device includes: a plate-shaped terminal including one main surface and another main surface and having one end electrically connected to a semiconductor chip; a nut arranged on the one main surface side at another end of the terminal; a nut cover provided on the one main surface side at the other end of the terminal and configured to cover the nut; and a case configured to surround the semiconductor chip and integrate the terminal and the nut cover, wherein the nut cover includes a protruding portion protruding from a lower portion of the nut cover to the one end side of the terminal.

Semiconductor device and method for manufacturing same

A semiconductor device includes an insulating substrate on which semiconductor elements are mounted and a surrounding case in which the insulating substrate is housed. Two terminal conductors, both ends of each of which are fixed in sidewalls of the surrounding case, are provided between the sidewalls, and connection terminals protruding toward the insulating substrate side are provided on the respective terminal conductors. The connection terminals and a conductive foil on the insulating substrate are soldered together. Insulating blocks for keeping the distance between the adjacent terminal conductors at a fixed distance or greater are provided in the vicinity of the central portion of the terminal conductor. The insulating blocks suppress the terminal conductor being deformed by being thermally expanded when soldering. Because of this, it is possible to stabilize solderability, and it is possible to prevent an occurrence of defective connection.

Semiconductor device

Semiconductor module

A control terminal of an intelligent power module has a structure in which it is possible to reduce the area used exclusively by the module. An insulating circuit substrate on which power semiconductor elements are mounted, and a printed substrate having a control circuit, are arranged in a tiered structure, and a structure is adopted in which control terminals through which input control signals into a control substrate, as well as being formed into a linear shape, are caused to stand upright by being inserted into control terminal insertion holes provided in a case bottom portion of a module and the through holes of the printed substrate.

A semiconductor device includes an insulating substrate having a semiconductor element mounted thereon; an outer case accommodating the insulating substrate; and a metallic terminal bar disposed above the insulating substrate and fixed to side walls of the outer case at both ends thereof. Each of both ends of the terminal bar at a position close to the side wall of the outer case at a surface on an opposite side to a surface facing the insulating substrate is provided with a pressed groove.

Semiconductor device and semiconductor device manufacturing method

In aspects of the assembly jig and method of the invention, when a packaging substrate is curved concaving upward at temperatures of melting solder, the gap between the assembly jig and the packaging substrate can be made smaller than the dimension of the sum of the thickness of the semiconductor chip and the thickness of the melted solder by allowing a part of the bottom surface of the chip positioning piece to become always, or substantially always, in contact with the upper surface of the packaging substrate owing to the weight of the chip positioning jig itself. As a consequence, the semiconductor chip does not slip aside out of the opening of the chip positioning piece. Therefore, the semiconductor chip can be positioned accurately on the packaging substrate.

Growing community of inventors

Omachi, Japan

Hideaki Takahashi