Sumitomo Bakelite Company Limited

Hideaki Sasajima

Hitoshi Kawaguchi

Hiroshi Hirose

The fixing resin composition for use in a rotor includes a thermosetting resin (A) containing an epoxy resin, a curing agent (B), and an inorganic filler (C), wherein the content of the inorganic filler (C) is equal to or more than 50% by mass, based on 100% by mass of the total content of the fixing resin composition.

Fixing resin composition for use in rotor

There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.

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Tokyo, Japan

Hideaki Sasajima