Mitsubishi Materials Corporation

Stmicroelectronics(tours) Sas

Lg Electronics Inc.

Samsung Sdi Co., Inc.

Mitsubishi Cable Industries, Ltd.

Mitusbishi Materials Corporation

Stmicroelectronics (rousset) Sas

Hideaki Sakurai

Nobuyuki Soyama

Toshihiro Doi

Shintaro Iida

Toshiaki Watanabe

Yoshirou Kuromitsu

Takashi Noguchi

Jun Fujii

Makoto Urushihara

Guillaume Guegan

Ginjiro Toyoguchi

Reiko Izumi

Yukiya Yamashita

Ken Hayashii

Kenzo Nakamura

Akira Nishihara

Takeshi Ikeda

Eung Chul Park

Kazunori Igarashi

Hiroyuki Kamibayashi

Jyunko Isomura

Koji Hirano

Yoshio Kanda

Kunio Sugamura

Kenji Kawamura

Tsuyoshi Takubo

Keiko Ashida

Yasuhiko Kudo

Jyunko Hirata

Toyokazu Nagato

Ryuji Uesugi

Young Cheul Kang

Eun Gi Heo

Young Soo Seo

Seung Jae Chung

Joon Min Kim

Hyun Sub Lee

An insulated copper wire is an insulated copper wire having a copper wire and an insulating film coating a surface of the copper wire, in which the insulating film contains a polymer material having an amide bond, on a peeled surface formed on a surface of the insulated copper wire by peeling off the insulating film, there more copper atoms bonded to a nitrogen atom or a carbon atom than copper atoms bonded to an oxygen atom, an oxygen-containing layer containing 10 atom % or more of oxygen in a depth direction from the peeled surface is formed, and a film thickness of the oxygen-containing layer is in a range of 2 nm or more and 30 nm or less. An electric coil is formed by winding the above-described insulated copper wire.

Insulated copper wire and electric coil

There is provided an insulated electric wire formed by covering a rectangular conductor wire having a rectangular cross-sectional shape with an insulating film. The insulating film is formed of an inner layer covering a surface of the rectangular conductor wire, and an outer layer covering a surface of the inner layer. A thickness (t) of a section of the inner layer, which covers one short side of two facing short sides of the same length of a rectangular cross section of the rectangular conductor wire, is greater than a thickness (t) (including that t=0) of a section of the inner layer which covers the other short side. An elastic modulus and/or a yield stress of the inner layer are less than an elastic modulus and/or a yield stress of the outer layer.

Insulated electric wire, production method therefor, coil and coil production method using same

An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.

Insulated conductor and insulated conductor manufacturing method

There is provided an insulated flat rectangular conductor including: a flat rectangular conductor; and an insulating film coating the flat rectangular conductor, in which the flat rectangular conductor has a first surface and a second surface opposite to the first surface, and the first surface is rougher than the second surface.

Insulated flat rectangular conductor, coil, and method of producing insulated flat rectangular conductor

An insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a fluorine-containing resin composition layer including a cured product of a thermosetting resin and a fluororesin and a fluorine concentration gradient layer which is disposed between the conductor and the fluorine-containing resin composition layer. The fluorine-containing resin composition layer includes a cured product of a thermosetting resin and a fluororesin, and is provided with a concentration gradient in which a fluorine atom content decreases from the fluorine-containing resin composition layer side toward the conductor.

An electrodeposition dispersion of the present invention is formed of a dispersion medium and a solid content. The solid content includes polyimide-based resin particles and fluorine resin particles. Also, a content ratio of the fluorine resin particles in the solid content is 20 to 70% by mass. In addition, a median diameter of the polyimide-based resin particles is 50 to 400 nm.

Electrodeposition solution and method for producing conductor with insulating film using same

Provided is an electrodeposition dispersion including a polyamide-imide resin, a polar solvent, water, a poor solvent, and a base, in which the polar solvent is an organic solvent having a boiling point of higher than 100&#xb0; C. and Drepresented by a formula (1) satisfying a relationship of D&#x3c;6, and a weight-average molecular weight of the polyamide-imide is 10&#xd7;10to 30&#xd7;10or a number-average molecular weight of the polyamide-imide is 2&#xd7;10to 5&#xd7;10.=[()+()+()]&#x2003;&#x2003;(1)

Electrodeposition liquid and electrodeposition-coated article

There is provided an insulated electric wire comprising a conductor wire coated by an insulating film, in which the insulating film contains 5 to 20% by mass of a low boiling point component having a boiling point of less than 300&#xb0; C. under normal pressure. The insulating film preferably has a thickness of 40 to 65 &#x3bc;m. The conductor wire preferably has a cross-sectional shape in a rectangular shape or a square shape.

Insulated electric wire, method for manufacturing same, and coil

A water-based electrodeposition dispersion for forming an insulating film contains polymer particles, an organic solvent, a basic compound, and water, the polymer particles are made of polyamide-imide, and the basic compound is a nitrogen-containing compound in which the HSP distance from water is 35 or greater.

Water-based electrodeposition dispersion for forming insulating film

A water-dispersed electrodeposition solution () for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water. The polymer particles are made of: any one of; or both of polyamide-imide and polyester-imide, main chains thereof being free of an anionic group, a number-based median diameter Dof the polymer particles is 0.05 &#x3bc;m to 0.5 &#x3bc;m, and polymer particles having a particle size within &#x2212;30% to +30% of the number-based median diameter Dare 50% or more of all of the polymer particles on a number basis.

Water-dispersed electrodeposition solution for forming insulating film

This insulated flat conductive wire includes: a flat conductive wire having an aspect ratio a/b of 12 or more, wherein the aspect ratio is a ratio of a length a of a long side of a rectangular cross-section to a length b of a short side thereof; and an insulating film which consists of a polyamide-imide resin or a polyimide resin and coats the flat conductive wire, wherein the insulating film has a film thickness t1 of 10 &#x3bc;m or more at a center portion of the long side of the rectangular cross-section, and the insulating film has a film thickness ratio t1/t2 of 0.80 to 1.35, and wherein the film thickness ratio t1/t2 is a ratio of the film thickness t1 at the center portion of the long side to a film thickness t2 at an edge portion of the long side of the rectangular cross-section.

Insulated flat conductive wire having high aspect ratio, method for manufacturing same, and coil

A composition for forming a Ce-doped PZT-based piezoelectric film contains: PZT-based precursors containing metal atoms configuring the composite metal oxides; a diol; and polyvinylpyrrolidone. The PZT-based precursors are contained so that a metal atom ratio (Pb:Ce:Zr:Ti) in the composition satisfies (1.00 to 1.28):(0.005 to 0.05):(0.40 to 0.55):(0.60 to 0.45) and the total of Zr and Ti in a metal atom ratio is 1. A concentration of the PZT-based precursor in 100 mass % of the composition is from 17 mass % to 35 mass % in terms of an oxide concentration, a rate of diol in 100 mass % of the composition is from 16 mass % to 56 mass %, and a molar ratio of polyvinylpyrrolidone to 1 mole of the PZT-based precursor is 0.01 moles to 0.25 moles in terms of monomers.

Composition for forming Ce-doped PZT-based piezoelectric film

This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.

Insulated wire with soldered portion and method for manufacturing same

A water-based electrodeposition dispersion for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water, wherein the polymer particles include polyamic acid having a predetermined structural unit, and a volume-based median diameter (D) of the polymer particles is 0.08 &#x3bc;m to 0.7 &#x3bc;m.

A composition for forming a PZT-based piezoelectric film formed of Mn-doped composite metal oxides is provided, the composition including: PZT-based precursors containing metal atoms configuring the composite metal oxides; a diol; and polyvinylpyrrolidone, in which when a metal atom ratio in the composition is shown as Pb:Mn:Zr:Ti, the PZT-based precursors are contained so that a metal atom ratio of Pb is satisfied to be from 1.00 to 1.20, a metal atom ratio of Mn is satisfied to be equal to or greater than 0.002 and less than 0.05, a metal atom ratio of Zr is satisfied to be from 0.40 to 0.55, a metal atom ratio of Ti is satisfied to be from 0.45 to 0.60, and the total of Zr and Ti in a metal atom ratio is 1.

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Naka-gun, Japan

Hideaki Sakurai