Mitsubishi Denki Kabushiki Kaisha

Hideaki Ootsuki

Hayato Takasago

Mitsuyuki Takada

Toru Kokogawa

In a method of packaging a semiconductor device, the semiconductor device and a mounting body are positioned in such a manner that electrodes of the semiconductor device and leads of the mounting body are brought into slidable mechanical contact with each other, the electrodes being not bonded to the leads. Next, an insulating resin that shrinks on setting is supplied in such a manner that the contacted portions of the electrodes and the leads are covered. Subsequently, the resin is set while keeping the electrodes and the leads in contact with each other to bond the electrodes to the leads whereby the resin, when set, applies a compressive force between the electrodes and the leads.

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Amagasaki, Japan

Hideaki Ootsuki