Sumitomo Electric Industries, Limited

Other

Tokyo Institute of Technology

Research Development Corporation of Japan

Hideaki Nishizawa

Mitsuo Takahashi

Yasuharu Suematsu

Masanori Nishiguchi

Atsushi Miki

Naoyuki Yamabayashi

Mitsuaki Fujihira

Shin-Ichi Iguchi

Method of measuring junction temperature

Disclosed are a distributed Bragg reflector type semiconductor laser and a method of manufacturing such a laser a high yields, in which the upper surface of an active waveguide is covered by an external waveguide, the external waveguide at side portions thereof, the external waveguide is coupled with the edge surfaces of the active waveguide without any gap remaining, and the coupling ratio of the active waveguide and external waveguide is high.

Method of manufacturing a distributed brass reflector type semiconductor

Disclosed are a distributed Bragg reflector type semiconductor laser and a method of manufacturing such a laser a high yields, in which the upper surface of an active waveguide is covered by an external waveguide, the external waveguide is disposed on the same surface as the active waveguide at side portions thereof, the external waveguide is coupled with the edge surfaces of the active waveguide without any gap remaining, and the coupling ratio of the active waveguide and external waveguide is high.

Distributed bragg reflector type semiconductor laser

In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bonding pad by said solder layer, the optical device chip is die-bonded in a stable state.

Method for producing an optical device

Package for optical device

Photodiode

A package for an optical element which receives or emits light thereinto or therefrom and is bonded on a substrate is disclosed. The substrate is a transparent one. An electrode pad including a window therein is formed on the top of the substrate and the optical element is bonded on the top of the electrode pad. By this structure, light is received into or emitted from the optical element through the transparent substrate and the window formed in the electrode pad.

Package for optical element

The present invention provides monolithic-structure type photodiodes in which the first photodiode is sensitive to an optical signal having one wavelength and the second photodiode is sensitive to another optical signal having a different wavelength, and in which the first and second photodiodes are superimposed together with an optical filter layer interposed between them which separates a multiplex optical signal into the first and second wavelength signals. Owing to their monolithic structure, the photodiodes of the present invention are extremely useful for receiving multiplex optical signals having a plurality of different wavelengths.

Multi-photodiodes

Growing community of inventors

Osaka, Japan

Hideaki Nishizawa