Tdk Corporation

Other

Semiconductor Energy Laboratory Co., Ltd.

Hitachi Metals, Ltd.

Kajima Corporation

Tokyo Denki Kagaku Kogyo Kabushiki Kaisha

Tokyo Denki Kagaku Kogyo Kabushiki Kaisha (tdk Electronics Co., Ltd.)

Hideaki Ninomiya

Kazuo Nishi

Kiyoshi Hatanaka

Hisao Morooka

Hirotaka Yamamoto

Shinya Nakai

Toshinobu Miyakoshi

Haruo Nishino

Makoto Kobayashi

Takeshi Takahashi

Toshiaki Yamada

Takashi Kamiya

Kuniaki Sato

Yukihiro Isobe

Hideaki Shimoda

Satoshi Sendai

Yoshinari Yamashita

Ryoichi Kondo

Makoto Hosokawa

Junichi Shimamura

Yoshihiro Nakamura

Atsushi Yakuwa

Yasuhiro Imamura

Yoshihito Yamamoto

Atsushi Yamada

Akio Koyama

Norihiro Kaiya

Naoyuki Amaya

The present invention provides a substrate holding method capable of contributing to improvement in performance of an electronic part. A plastic film is adhered to a holding frame by using an adhesive tape having a proper gas releasing characteristic such that total quantity of gas detected when analysis using gas chromatograph mass spectrometry (dynamic HS-GC-MS) is conducted under test conditions of 180&#xb0; C. and 10 minutes is 100.5 &#x3bc;g/g or less in n-tetradecane. In the case where the plastic film held by the holding frame is subjected to a process of manufacturing an electronic part (for example, a solar battery), even when a process accompanying generation of heat during the manufacturing process (for example, a film forming process such as plasma CVD) is performed on the plastic film, a release amount of unnecessary gas released from the adhesive tape due to the influence of the heat is suppressed, so that deterioration in the performance of the electronic part caused by the unnecessary gas is suppressed.

Method of manufacturing electronic part

An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate in a pounched-out portion made in the first ceramic substrate and by planarizing its top and bottom surfaces, wherein a conductive layer is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.

Production method for a multilayer ceramic substrate

A method for producing a multilayer ceramic substrate having a cavity formed therein includes punching a through opening corresponding to the cavity in green sheets constituting a laminate, and printing a conductor at a predetermined position of the green sheets, laminating the green sheets to constitute a green sheet laminate, and applying a pressure to the green sheet laminate by using a compression member having a projection at a position corresponding to the cavity to thereby compress the green sheet laminate. The projection has a height which is equal to the depth of the cavity multiplied by compression ratio of the green sheet laminate, and the green sheet laminate is compressed by applying the pressure such that compression ratio of the bottom of the cavity is identical with the compression ratio of other parts of the green sheet laminate.

Method for producing a multilayer ceramic substrate

It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. The high-frequency module according to the present invention includes a main module including a first high-frequency circuit at least a part of which is constituted by a conductive pattern built in a multi-layered substrate and a sub-module including a second high-frequency circuit, and the sub-module is inserted into a cavity formed in the main module. According to the present invention, the main module including the first high-frequency circuit and the sub-module including the second high-frequency circuit are constituted as separate components and the main module and the sub-module are integrated by inserting the sub-module into the cavity formed in the main module. Therefore, it is possible to use only a main module and sub-module that have been inspected after manufacture and found to be non-defective. Accordingly, it is possible to markedly increase the yield of the high-frequency module as a whole.

High-frequency module

A frame-shaped holding frame which has a small thermal expansion coefficient is used. When a complex member in which a metal material is impregnated in a ceramic material, which has a smaller thermal expansion coefficient than 10 ppm/&deg; C., is used, a warp and a wrinkle are greatly decreased. In particular, in the case of a material with a thermal expansion coefficient of 6.5 ppm/&deg; C. or smaller, the warp and the wrinkle are not caused. When the flexible substrate is adhered to the holding frame by an adhesive, an adhesion area may be obtained so that a sufficient strength is kept. Also, since the flexible substrate is adhered onto the upper surface of the holding frame, the thickness of the holding frame is independent on fixing of the substrate. The thickness may be set so that a mechanical strength is kept and the substrate is smoothly transferred.

Method of supporting a flexible substrate and method of manufacturing a semiconductor device

The invention relates to a desired shaped plane type solar cell. The solar cell includes a plurality of photoelectric conversion devices formed by dividing the plane, a plurality of conductive paths for connecting each of the photoelectric conversion devices to each other in series, the conductive path being provided adjacent to the plurality of photoelectric conversion devices, and two drawing electrodes exposed on an opposite surface to a light irradiated surface, the electrodes being connected to two photoelectric conversion devices on both ends of the photoelectric conversion device connected in series.

Planar solar cell array and production method of the same

A film comprises glass fiber impregnated with a low dielectric polymer obtained by polymerizing a monomeric composition comprising a fumaric acid diester monomer and optionally a vinyl monomer. The polymer having a low dielectric constant and reduced dielectric loss is used as an electrically insulating material in a high frequency band of at least 500 MHz.

Low dielectric polymer and film, substrate and electronic part using the

A multilayer band pass filter includes a zero point forming capacitor formed by a plurality of capacitors connected in series between first and second extension electrodes, and intermediate capacitors connected between each pair of adjacent series capacitors and the open end of a core conductor. Therefore, zero points can be formed at the lower and upper limits of a given band. The capacity of these capacitors is adjustable via extension electrodes which extend outside the baked ceramic casing, thereby allowing adjustment to be made to the zero point.

Multilayer band pass filter with a zero point forming capacitor

An overcoating inorganic composition is applied to a ceramic substrate for forming an overcoat thereon which has improved flexural strength, matches in thermal expansion with the substrate, and is reliable in that it is free of a crack and causes no variation in the resistance of thick film resistors even under rigorous service conditions. The overcoating inorganic composition contains 70-90% by volume of an inorganic glass component and 10-30% by volume of mullite powder and has a coefficient of thermal expansion in the range of from 50.times.10.sup.-7 to 75.times.10.sup.7 /.degree. C.

Overcoating inorganic composition

High-quality ceramic bodies suitable for use as a substrate of electronic devices can be prepared by sintering, at an outstandingly low temperature of 1000.degree. C. or below, a binary powder mixture composed of 30-50% by weight of a non-glassy phase of aluminum oxide and 70-50% by weight of a glassy phase having a quaternary composition composed of silicon dioxide, boron oxide, aluminum oxide and one or more of alkaline earth metal oxides, of which at least 60% by weight is strontium oxide, each constituent being formulated in a specified weight fraction. The ceramic body is particularly advantageous over conventional ones, along with the high mechanical strengths and low dielectric constant, in respect of the resistance against migration of metals therethrough when the ceramic body is in contact with metal-made parts such as electrodes.

Sintered ceramic body

Fittings for connecting columns and beams of a steel frame construction, each comprising a substantially rectangular base plate to be connected to the column by means of high strength bolts and having centrally a horizontally continuous thicker portion from which the base plate is tapered toward upper and lower edges, a horizontal protrusion projecting from the thicker portion in opposition to a flange of the beam and vertical protrusion in opposition to a web of the beam and projecting from the base plate to form with the horizontal protrusion a T-shaped protrusion.

Fittings for connecting columns and beams of steel frame construction

The electroconductive composite ceramics composed of an independent phase conglomerates having a particle diameter of at least 20.mu. and a continuous phase connecting mutually the independent phase of conglomerates. Particularly, electroconductive composite ceramics composed of (A) 50-98% by weight of an independent phase of conglomerates having a particle diameter of at least 20 which consists essentially of a phase of insulating or semiconductive ceramics having a high melting point or a mixture thereof and (B) 50-2% by weight of a continuous phase of an electroconductive substance connecting mutually the independent phase of conglomerates. The electroconductive composite ceramics exhibit stable electroconductivity-temperature characteristics at a temperature of 1000.degree. C. or higher and have excellent thermal shock resistance, mechanical strength and chemical resistance.

Electroconductive composite ceramics

Low thermally expansive, electroconductive composite sintered ceramics comprised of a phase of at least one ceramics selected from the group consisting of low thermally expansive ceramics and negatively thermally expansive ceramics, having dispersed thereinto substantially in a continuous state a phase of an electroconductive substance such as a metal.

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Tokyo, Japan

Hideaki Ninomiya