Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hideaki Nagatoshi

Hidehiko Karasaki

Tsutomu Yano

Katsuichi Ukita

Hisashi Kinoshita

Kazuhide Isaji

Kazutomo Kotera

A machining device for simultaneously machining a plurality of work pieceson one machining tablewith high positional accuracy is provided. The machining device detects positions of the work pieceswith detectorsmounted to respective machining heads. The machining device has respective units for, based on the positional data, moving the machining tableto a position where displacements of respective machining headsare nearly equal, and for moving machining ranges of machining headsso as to substantially eliminate displacements between respective machining headsand work pieces

Machining device and machining method

A laser processes a circuit board including at least two layers. The two layers are a conductive layer with a plurality of holes and an insulating layer. The conductive layer is disposed on a surface layer of the insulating layer which is to be processed by applying a laser beam to portions of the insulating layer corresponding to the holes of the conductive layer. The circuit board is irradiated with the laser beam, and a reflected laser beam is detected, whereby the laser processing of the insulating layer corresponding to an abnormal hole in the conductive layer is stopped, if the detected value of the reflected laser beam is an abnormal value differing from a desired value. Also, the insulating layer corresponding to the hole is processed when the detected value of the reflected light conforms to the desired value.

Laser processing method and equipment for printed circuit board

Growing community of inventors

Osaka, Japan

Hideaki Nagatoshi