Nissha Co., Ltd.

Nissha Printing Co., Ltd.

Hideaki Nada

Yuki Matsui

Yoshihiro Sakata

Jumpei Morita

Hirotaka Shigeno

Hisaya Takayama

Hiroaki Uefuji

A pressure sensor is disclosed. The pressure sensor includes a common electrode, a plurality of individual electrodes, a plurality of thin-film transistors and a common pressure-sensitive layer. The common electrode is formed as a layer. The plurality of individual electrodes are arranged in a matrix opposing the common electrode. The plurality of thin-film transistors are respectively located corresponding to the individual electrodes on sides of the individual electrodes opposite to the common electrode, where one or two or more adjacent thin-film transistors are connected to one individual electrode. The common pressure-sensitive layer is disposed on a surface of the common electrode on a side facing the plurality of individual electrodes. The plurality of individual electrodes include a first electrode, and a second electrode that is thicker than the first electrode and therefore creates a smaller gap from the common pressure-sensitive layer than the first electrode.

Pressure sensor

A pressure sensor is disclosed. The pressure sensor includes a common electrode, sensitized electrodes, mountain-shaped pressure-sensitive layers, and thin-film transistors. The common electrode is formed as a layer. The sensitized electrodes are arranged in a matrix opposing the common electrode. The mountain-shaped pressure-sensitive layers are respectively formed over the sensitized electrodes on a side close to the common electrode. The thin-film transistors are disposed to correspond to the sensitized electrodes on sides of the sensitized electrodes opposite to the common electrode. A distance between the sensitized electrodes and an outer edge of a contact surface at which the common electrode and the mountain-shaped pressure-sensitive layers contact gradually becomes narrower when, due to pressing force applied to the common electrode toward the mountain-shaped pressure-sensitive layers and the sensitized electrodes, the contact surface expands outward from central portions of the mountain-shaped pressure-sensitive layers when viewed in plan.

[Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered filmof a Cu layerand CuNO-based blackening layers (and); a step of forming a resist layerin a predetermined region on the layered film; and a step of removing a partial region of the layered filmby bringing the layered filminto contact with an etchant.

Method for producing electrical wiring member and electrical wiring member

[Object] The present invention provides an active device in which the misalignment of a partition relative to electrodes is reduced and a method for manufacturing an active device. [Solution] An active device according to the present invention includes a substrate, a first electrodeand a second electrodeformed adjacent to each other on one main surface of the substrate, an organic semiconductor layerformed on the one main surface of the substrateat least over a region between the first electrodeand the second electrode, and a partitionformed on the one main surface of the substratein a region that is located outside the organic semiconductor layerin a planar direction and that is different from regions where the first electrodeand the second electrodeare formed. The partitionis formed of a conductive material.

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Kyoto, Japan

Hideaki Nada