The Furukawa Electric Co., Ltd.

Mitsubishi Heavy Industries Limited

Mitsubishi Heavy Industries Machinery Systems, Ltd.

Mitsubishi Heavy Industries Mechatronics Systems, Ltd.

Japan Engine Corporation

Hideaki Murata

Takahiro Okada

Takashi Sonoda

Masato Sakata

Jun Yasui

Takeshi Nagata

Hisaji Takeuchi

Tetsuya Adachi

Kazuumi Kondo

Yukio Kazama

Keiichi Morishita

Takeshi Aikiyo

Ryota Hiura

Hiroyuki Ishida

Kazuto Ono

Yoshifumi Hayakawa

Seiki Kato

Hirotoshi Matsumoto

Naoki Oyama

Keiji Ida

Kai Zhang

Naohiro Hiraoka

Yasuyuki Komada

Sota Watanabe

A wireless power supply device that wirelessly supplies power from a stator side to a plurality of power-receiving antennas disposed on a rotor rotated about an axis (O) at intervals in a circumferential direction includes: an oscillator () that oscillates a high-frequency signal; and an annular power transmitter () that has a leaky waveguide () in which a plurality of radiating portions () that radiate the high-frequency signal as a radio wave are arranged in the circumferential direction and extend in a circular arc shape in the circumferential direction.

Wireless power supply device, telemetric measuring system, rotating machine, system for supplying power wirelessly to rotating body, and turbine system

In a location detecting system, an on-vehicle device is provided at each vehicle a location detecting unit detecting a location of the vehicle, a communication unit, and a CPU unit controlling the location detecting unit and the communication unit. Each of the on-vehicle devices includes a GPS trajectory information processing unit acquiring GPS trajectory information of each of the vehicles, the communication unit broadcasts requests for the GPS trajectory information, the communication units of other vehicles transmit the held GPS trajectory information to the communication unit of one vehicle when a distance to the vehicle is less than a predetermined value, the GPS trajectory information processing unit passes the GPS trajectory information from the other vehicles to the location detecting unit, and the location detecting unit of the vehicle outputs the location information of the vehicle based on the GPS trajectory information.

Location detecting system and location detecting method of the location detecting system

A vehicle position measurement method includes a process of determining whether or not position information of an own vehicle is able to be acquired with predetermined quality from the outside, a process of acquiring position information of a nearby vehicle present in an area in which the own vehicle is capable of acquiring information when the position information is determined not to be able to be acquired with the predetermined quality, and a process of replacing the position information of the own vehicle with the acquired position information of the nearby vehicle.

Position measurement method, own position measurement device, and on-board unit

An on-board unit includes a first antenna and a second antenna, a traffic data service communicating section corresponding to a traffic data service; a billing service communicating section corresponding to a billing service, a switch which switches a connection relation between each of the first antenna and the second antenna and the traffic data service communicating section and the billing service communicating section, a control section which controls the switch. When the operation mode is switched from the traffic data service mode to the billing service mode, the on-board unit is set to a switching communication mode in which one of the first antenna and the second antenna is connected with the traffic data service communicating section and the other is connected with the billing service communicating section.

On-board unit, communication method, and recording medium

A communication system includes an on-board unit adapted to a vehicle-vehicle communication and roadside equipmentperforming a roadside-vehicle communication. In communications in service channels of the vehicle-vehicle communication, one reception-only service channel in which the on-board unit only performs a reception operation is provided for a plurality of the service channels and communications in the reception-only service channel is performed at the same frequency as that of the control channels of the roadside-vehicle communication. When the vehicle-vehicle communication is performed, the on-board unit performs switching to the roadside-vehicle communication in response to detection of reception in the reception-only service channel of a radio signal transmitted from the roadside equipmentin a control channel of the roadside-vehicle communication.

Vehicle communication system, on-board unit, recording medium and communication method

An inspection device and an inspection method for boiler furnace water wall tubes. The inspection device includes a scanner including columns placed upright and fixed by magnets onto the surfaces of multiple water wall tubes extending in the up-down direction on the inner wall surfaces of the boiler furnace, a support frame fixed to the columns to support a displacement sensor producing laser light to be irradiated onto the surface of a water wall tube, and a moving mechanism for moving the displacement sensor in the axial direction of the water wall tube relative to the support frame. A signal processing unit calculates the amount of reduced wall thickness of the water wall tube from a difference between the cross-sectional surface shape of the water wall tube based on a signal from the displacement sensor and a reference shape without reduction in wall thickness.

Inspection device and inspection method for boiler furnace water wall tubes

A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.

Semiconductor device package

An optical semiconductor element package including a housing, electric signal input and output wiring boards, and external leads. The housing has a metal frame and a metal bottom plate, for storing optical semiconductor elements. The electric signal input and output wiring boards are arranged in the housing at positions so that the optical semiconductor elements are not existent right above and right below the boards. The external leads are drawn to the outside through the side wall of the metal frame. The wiring boards are connected to the external leads and to the optical semiconductor elements by bonding wires. The input and output of an electric signal between the outside and the optical semiconductor elements are carried out through the bonding wires, the wiring boards and the external leads.

Optical semiconductor element package and manufacturing method thereof

A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340.degree. C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240.degree. C. to 260.degree. C. for 5 minutes or more after the soldering step.

Optical module package and method for manufacturing the same

A package for optical semiconductor device comprising a metallic frame having a side wall provided with an optical fiber-securing portion for securing an optical fiber to be introduced through the side wall, and a metallic bottom plate for mounting the optical semiconductor device thereon. The metallic frame is provided at a lower portion of the side wall thereof with securing parts for securing the package to a substrate, each securing part outwardly extending in a direction parallel with the metallic bottom plate. The level of bottom face of the metallic bottom plate is made lower than that of the bottom face of the securing parts. The securing parts are integrally formed with the metallic frame.

Growing community of inventors

Tokyo, Japan

Hideaki Murata