Sumitomo Electric Industries, Limited

A.l.m.t. Corporation

Hideaki Morigami

Katsuyuki Tanaka

Akihisa Hosoe

Tetsuo Nakai

Kengo Goto

Katsuhito Yoshida

Takashi Ishii

Isao Iwayama

Kouichi Takashima

Masashi Narita

Tomoaki Ikeda

Ryota Matsugi

Fukuto Ishikawa

Masanori Sugisawa

Takahiro Awaji

Chieko Tanaka

A heat radiation member excellent in electrical insulation and better in thermal conduction is provided. The heat radiation member includes a substrate composed of a composite material containing diamond and a metallic phase, an insulating plate provided on at least a part of front and rear surfaces of the substrate and composed of an aluminum nitride, and a single bonding layer interposed between the substrate and the insulating plate, the heat radiation member having thermal conductivity not lower than 400 W/m·K.

Heat radiation member

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 &#x3bc;m.

Composite member

Provided are a heat sink material made of an alloy or a composite material including two or more types of elements which has an end surface that makes possible formation of an edge portion on which at least a laser element is mounted, a manufacturing method for the same, and a semiconductor laser device including the heat sink material. A heat sink material () is made of an alloy or a composite material including two or more types of elements, and provided with a main surface having a relatively large area and a secondary surface having a relatively small area which crosses the main surface, and the secondary surface includes a surface on which a discharging process has been carried out using a discharge wire () that is placed approximately parallel to the main surface. The manufacturing method for the heat sink material () is provided with the steps of placing the discharge wire () on a material () to be approximately parallel to the main surface, and carrying out the discharging process on the material () using the discharge wire () placed as described above.

Manufacturing a heat sink material using a discharge wire

The invention provides a semiconductor element mounting substrate that, by virtue of an improvement in thermal conduction efficiency between the substrate and another member, can reliably prevent, for example, a light emitting element such as a semiconductor laser from causing a defective operation by heat generation of itself, by taking full advantage of high thermal conductivity of a diamond composite material. In the semiconductor element mounting substrate, a connecting surface to be connected with the light emitting element or the like is finished such that the number, per unit area, of at least either recesses or protrusions having a depth or height of 10 &#x3bc;m to 40 &#x3bc;m and a surface-direction diametrical size of 10 &#x3bc;m to 3 mm is 50/cmor less, and on the connecting surface, a coating layer, which is formed of a solder or a brazing material, has a thickness of 1 &#x3bc;m to 30 &#x3bc;m, an arithmetic mean roughness Rof a roughness curve showing a surface roughness of R&#x2266;2 &#x3bc;m, and a maximum height roughness Rof R&#x2266;15 &#x3bc;m, and fills and covers the recesses or protrusions, is formed.

Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate

This invention relates to a high thermal conductivity composite material which comprises diamond particles and a copper matrix useful as electronic heat sinks for electronics parts, particularly for semiconductor lasers, high performance MPUs (micro-processing units), etc., also to a process for the production of the same and a heat sink using the same. According to the high thermal conductivity diamond sintered compact of the present invention, in particular, there can be provided a heat sink having a high thermal conductivity as well as matching of thermal expansions, most suitable for mounting a large sized and high thermal load semiconductor chip, for example, high output semiconductor lasers, high performance MPU, etc. Furthermore, the properties such as thermal conductivity and thermal expansion can freely be controlled, so it is possible to select the most suitable heat sink depending upon the features and designs of elements to be mounted.

Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it

A bonding tool capable of uniformly pressing all electrodes of a semiconductor element and surely bonding all the electrodes and leads, even if the end pressing surface of a tool end part of a bonding tool is enlarged with the large-sized and long-sized tendency of semiconductor elements, is provided in which an end pressing surface of a tool end part fitted to a shank is composed of a hard material, characterized in that the end pressing surface is gradually curved to form a concave surface from the peripheral part to the central part at an application temperature of the bonding tool and the degree of flatness of the concave end pressing surface is in the range of 1 to 5 .mu.m at the application temperature of the bonding tool.

Bonding tool, production and handling thereof

A bonding tool capable of uniformly pressing all electrodes of a semiconductor element and surely bonding all the electrodes and leads, even if the end pressing surface of a tool end part of a bonding tool is enlarged with the large-sized and long-sized tendency of semiconductor elements, is provided in which an end pressing surface of a tool end part fitted to a shank is composed of a hard material, characterized in that the end pressing surface is gradually curved to form a concave surface from the peripheral part to the central part at an application temperature of the bonding tool and the degree of flatness of tile concave end pressing surface is in the range of 1 to 5 .mu.m at the application temperature of the bonding tool.

Growing community of inventors

Itami, Japan

Hideaki Morigami