Murata Manufacturing Co., Ltd.

Hideaki Matsushima

Tomoyuki Maeda

Mitsuru Odahara

Akihiro Ono

Tatsuya Mizuno

An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the electronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions.

Electronic component and manufacturing method thereof

An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.

Electronic component

A laminated coil component includes a spiral coil including laminated ceramic films and coil conductors. Pad portions provided at ends of the coil conductors are connected to one another using via-hole conductors to provide an interlayer connection among the pad portions. Thus, a spiral coil is provided. The pad portions are thinner than the coil conductors, and accordingly, a concentration of stress on portions at which the pad portions and the via-hole conductors overlap one another is reduced.

Laminated coil component and method for manufacturing the same

A multilayered electronic component that is easy to manufacture and that has excellent electrical characteristics includes end portions of coil wiring patterns that oppose a coil connection electrode that is displaced on the surface of a second ceramic layer due to an increase or decrease in the number of first ceramic layers. A coil connection electrode has a shape in which surface portions of second ceramic layers or opposed second ceramic layers having the first ceramic layers disposed in between are connected to the end portions of the coil wiring patterns that oppose the respective coil connection electrode, which are displaced due to the increase or decrease in the number of the first ceramic layers. A connection wiring pattern has a shape in which one portion of a coil connection electrode is connected to one portion of an external extension electrode connection pattern.

Method of manufacturing multilayered electronic component

Multilayered electronic component

A laminated coil array includes a laminate including a plurality of ceramic layers and a plurality of internal conductors disposed one on top of another, at least three coil conductors defined by electrically connecting internal conductors of the plurality of internal conductors and arranged in line inside the laminate, and external electrodes disposed on a surface of the laminate and electrically connected to end portions of the at least three spiral coil conductors, respectively. In the coil conductors not located on both end portions in the arrangement direction of the coil conductors, the internal conductors are arranged so as to be partially reversed.

Growing community of inventors

Echi-gun, Japan

Hideaki Matsushima