Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matushita Electric Industrial Co., Ltd.

Hideaki Komoda

Shinji Nakamura

Toshihiro Nishii

Toshiaki Takenaka

Shigeru Yamane

Kunio Kishimoto

Keiichi Ochiai

Takeshi Suzuki

Eiji Kawamoto

Nobuyuki Aoki

Toshikazu Kondo

Ikuo Ota

Masaki Aoki

Hideo Torii

Yukihiro Shimasaki

Yoshihiro Kawakita

Hideo Hatanaka

Yasuhiro Ueyama

Kenichi Fujii

Tetsuo Satake

Kiyohide Tatsumi

Yuichiro Sugita

Tohru Hori

Tomi Sato

Hozumi Hirota

Yasuharu Fukui

A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

Method of manufacturing clad board for forming circuitry, clad board and core board for clad board

A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.

Circuit-formed substrate and method of manufacturing circuit-formed substrate

The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet () provided with a squeegee cleaning section () formed thereon and fixed to the back surface of a slanting area () of mask () attached to a plate framework (). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.

Printing plate, circuit board and method of printing circuit board

A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.

Circuit board producing method and circuit board producing device

A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.

Circuit board and method of manufacturing same

Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board

A circuit board having stable connection resistance can be obtained . The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.

Multi-layer circuit board having at least two or more circuit patterns connected

An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and metallic foil are laminated to a substrate, and the laminated board is heated under pressures. After that, a laminated circuit pattern is formed by machining the metallic foil. In such multi-layer circuit board, a smoothing layer is disposed on a concave portion where no inner layer circuit pattern of the inner layer circuit board is formed. In this way, the conductive materials disposed in a plurality of through-holes are uniformly compressed. As a result, the connection resistance between the inner circuit pattern and the laminated circuit pattern becomes stabilized.

Multi-layer circuit board and method of manufacturing same

In the magnetic recording medium, the non-magnetic substrate has an under-coat layer including the first flake powder of non-magnetic material on its surface and further has a back-coat film including the second flake powder of non-magnetic material on the opposite face on the non-magnetic substrate to the one face coated by the magnetic film; thereby splendid property of running durability and electromagnetic transducing characteristics is achieved in spite of thinning the total thickness of the magnetic recording medium.

Magnetic recording medium

Disclosed herein is a magnetic recording medium having a magnetic layer comprising hexagonal ferrite magnetic particles each expressed as BaO.multidot.Fe.sub.12-x-y Sn.sub.x Mg.sub.y O.sub.18 (where, 0.55.ltoreq.x.ltoreq.0.88, 0.71.ltoreq.y.ltoreq.1.05). The hexagonal ferrite magnetic particles contained in this magnetic layer each have Sn and Mg partially substituted for Fe, the Sn and Mg being perfectly solid-soluble, thus being capable of providing hexagonal ferrite magnetic particles which are superior in crystalline properties and small in variation of composition. As a result, the coercivity distribution can be made further sensitive, both the self demagnetization and recording demagnetization in the short wave-length range can be reduced, and a higher reproducing output characteristic is attainable in the high density recording range.

Magnetic recording medium having a magnetic layer comprising hexagonal

A magnetic recording medium essentially composed of a substrate and a ferromagnetic thin film deposited on the surface of the substrate is provided herein. This ferromagnetic film is such as to have a minimum of 400 Oe of coercive force and composed mainly of an iron carbide. According to this construction, the magnetic characteristics are greatly improved.

Iron carbide thin film magnetic recording medium

The present invention provides a platelike magnetic powder made from a magnetic powder having particles each of which has a portion comprising the spinel type crystal structure and a portion comprising the magnetoplumbite type crystal structure. The magnetic powder provides a large saturation magnetization .sigma.s and a small temperature change .DELTA.Hc/.DELTA.T of coercive force in the vicinity of the room temperature. Further, the present invention is to provide a high density magnetic recording medium which uses the magnetic powder. Furthermore, the present invention is to provide, a method to easily manufacture the magnetic powder by the coprecipitation method. A raw material powder of superfine particles is prepared. The prepared powder is fired at a low temperature in a non-oxidizing atmosphere.

Platelike magnetic powder and a recording medium which uses the

A magnetic recording medium characterized in that a magnetic layer composed of the combination of oleic acid and ester, whereby it is better in the lubricating characteristics of the magnetic layer and in the abrasion resisting property of the magnetic layer, and superior in the durability in a wide temperature range.

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Osaka, Japan

Hideaki Komoda