Growing community of inventors

Tokyo, Japan

Hideaki Kobiki

Average Co-Inventor Count = 3.79

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 4

Hideaki KobikiKentaro Sato (3 patents)Hideaki KobikiSatoshi Uenosono (2 patents)Hideaki KobikiTakayuki Futatsuka (2 patents)Hideaki KobikiTomohiro Sakaidani (2 patents)Hideaki KobikiHoshiaki Terao (2 patents)Hideaki KobikiTatsuya Nakagaito (1 patent)Hideaki KobikiHiroki Ota (1 patent)Hideaki KobikiYoshikiyo Tamai (1 patent)Hideaki KobikiTsuyoshi Shiozaki (1 patent)Hideaki KobikiToru Minote (1 patent)Hideaki KobikiYuichi Tokita (1 patent)Hideaki KobikiMasaki Morino (1 patent)Hideaki KobikiHideaki Kobiki (6 patents)Kentaro SatoKentaro Sato (28 patents)Satoshi UenosonoSatoshi Uenosono (32 patents)Takayuki FutatsukaTakayuki Futatsuka (12 patents)Tomohiro SakaidaniTomohiro Sakaidani (9 patents)Hoshiaki TeraoHoshiaki Terao (8 patents)Tatsuya NakagaitoTatsuya Nakagaito (55 patents)Hiroki OtaHiroki Ota (51 patents)Yoshikiyo TamaiYoshikiyo Tamai (19 patents)Tsuyoshi ShiozakiTsuyoshi Shiozaki (17 patents)Toru MinoteToru Minote (10 patents)Yuichi TokitaYuichi Tokita (5 patents)Masaki MorinoMasaki Morino (2 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Jfe Steel Corporation (6 from 1,792 patents)

2. Jfe Precision Corporation (2 from 6 patents)

3. Toyota Jidosha Kabushiki Kaisha (1 from 36,499 patents)


6 patents:

1. 12031955 - Collision performance evaluation test method and apparatus for automobile body part

2. 11946828 - Side crash test apparatus and side crash test condition determination method for center pillar of automobile

3. 11604117 - Collision performance evaluation test method and collision performance evaluation test apparatus for automobile body part

4. 10626477 - Method for manufacturing hot press formed part and hot press formed part

5. 8557015 - Cr-Cu alloy, method for producing the same, heat-release plate for semiconductor, and heat-release component for semiconductor

6. 7955448 - Alloy for heat dissipation of semiconductor device and semiconductor module, and method of manufacturing alloy

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as of
12/4/2025
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