Toyoda Gosei Co., Ltd.

Sumita Optical Glass, Inc.

Koha Co., Ltd.

Other

Matsushita Electric Industrial Co., Ltd.

Aisin Seiki Kabushiki Kaisha

Toyota Gosei Co., Ltd.

Tsuchiya Co., Ltd.

Hideaki Kato

Yoshinobu Suehiro

Yuji Takahashi

Kanae Matsumura

Mitsuhiro Inoue

Kunihiro Hadame

Shunsuke Ohtsuka

Satoshi Wada

Shota Shimonishi

Naruhito Sawanobori

Tomohiro Miwa

Kazuya Aida

Koichi Kaga

Ryoichi Tohmon

Koichi Ota

Yoshinori Yamamoto

Hiroki Watanabe

Daisuke Kato

Masaaki Ohtsuka

Kiyotaka Teshima

Shigeo Takeda

Takemasa Yasukawa

Hisao Yamaguchi

Hideki Omoya

Hideyuki Nakano

Masayoshi Koike

Hiroyuki Tajima

Hiroaki Hayashi

Yosuke Tsuchiya

Masafumi Inoue

Tadaaki Ikeda

Yoshinori Masatsugu

Michio Miyawaki

Syota Shimonishi

Takashi Asaga

Tatsuya Takashima

Tohru Terajima

Kazuyoshi Tahashi

Seiji Takano

Soichiro Kono

Hiroki Teranishi

A rotary electric machine includes a rotor core fixed at a rotation axis, a stator core arranged facing the rotor core and including a plurality of teeth, a plurality of windings wound at the plurality of teeth of the stator core, a plurality of winding connection terminals connected to respective ends of the plurality of windings, a plurality of bus bars connected to the plurality of winding connection terminals, each of the plurality of bus bars being formed in either an arc form or an annular form, and a bus bar holder holding the plurality of bus bars in a laminated state and including a holder engagement portion engaging with a bus bar engagement portion which is provided at least at one of the plurality of bus bars.

Rotary electric machine with stator having bus bars with recesses and bus bar holder with protrusions engaged with the recesses

A light emitting device includes a substrate, a plurality of light emitting elements disposed on the substrate, a transparent resin embedded in a space between the plurality of light emitting elements, and a phosphor containing resin layer formed on the plurality of light emitting elements and the transparent resin. The transparent resin includes no phosphor.

Light emitting device and method of manufacturing the same

A light emitting device includes a wiring substrate, a light emitting element disposed on a front surface of the wiring substrate, and a conductor pattern formed on a rear surface of the wiring substrate. The conductor pattern includes a slit or a hole that fails to separate the conductor pattern into two parts.

Light emitting device and electronic component

A light-emitting device includes a plurality of light-emitting elements mounted on a wiring board, and a plurality of wirings that are provided on the wiring board and each connect predetermined ones of the plurality of light-emitting elements in series. A central element-connection wiring has a longest wiring length among the plurality of wirings, and a voltage applied to a central element is a lowest one of voltages applied to the plurality of light-emitting elements. A closest one of the plurality of light-emitting elements to a center of an element mounting region of the wiring board is defined as the central element, and a wiring that connects in series the central element is defined as the central element-connection wiring.

Light-emitting device

A wiring substrate includes a wiring pattern that is formed on a surface of a conductive board via an insulation layer and an extension part that is extended from the wiring pattern. The extension part is disposed in a portion located immediately below a detachable connector. The detachable connector is connected to a fixed connector mounted on the wiring substrate and connected and fixed to the wiring pattern.

Wiring substrate and substrate module

A light-emitting device includes a substrate having a metal film on a first surface, a light-emitting element mounted on the first surface of the substrate and connected to the metal film, a heat sensitive circuit breaker mounted on the first surface of the substrate and connected to the metal film, a light-proof cover that covers the heat sensitive circuit breaker to block light emitted from the light-emitting element and travelling toward the heat sensitive circuit breaker, and a heat dissipating member formed on a second surface of the substrate to dissipate heat of the substrate, the second surface being opposite to the first surface.

A light-emitting module includes: an LED lamp comprising; a flexible board; and a connection member that sandwiches and fixes the LED lamp and the flexible board. An electrode portion of the flexible board is pressed against an external electrode of the LED lamp by the connection member, whereby the external electrode directly contacts and is electrically connected to the electrode portion. A portion of the connection member highest from the substrate is lower than a portion of the sealing body highest from the substrate.

Light-emitting module having connection member to press for direct electrical contact

An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost. An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.

LED module for lighting

A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Solid element device and method for manufacturing the same

A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO&#x2014;NbO-based, BO&#x2014;F-based, PO&#x2014;F-based, PO&#x2014;ZnO-based, SiO&#x2014;BO&#x2014;LaO-based, and SiO&#x2014;BO-based low melting glasses.

A method for manufacturing a solid element device, which comprises providing a glass-containing AlOsubstrate () having a GaN based LED element () placed thereon, setting a PO&#x2014;ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415&#xb0; C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 10poise, and is adhered via an oxide formed on the surface of the glass-containing AlOsubstrate (). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.

An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.

LED lamp

A light emitting device has a light emitting element and an adhesion layer to bond the light emitting element to a mounting member. The adhesion layer is of inorganic material particles and a transparent inorganic binding layer to be formed between the neighboring inorganic material particles, and the inorganic material particles are substantially connected with each other in the adhesion layer. Another light emitting device has a light emitting element and a phosphor layer that radiates fluorescent light while being excited by light emitted from the light emitting element. The phosphor layer is of phosphor particles and transparent inorganic binding layer to be formed between the neighboring phosphor particles.

Light emitting device including adhesion layer

A light emitting apparatus has a light emitting element, and a transparent glass section and a metal section that surround the light emitting element. The transparent glass section and the metal section have a ratio in thermal expansion coefficient to the light emitting element in a range of 150% to 500%.

Light emitting apparatus

A light emitting device has a light emitting element portion that radiates light with a predetermined wavelength, and a wavelength conversion portion that surrounds a phosphor to be excited by the light with the predetermined wavelength with a transparent and non-moisture permeability material in the form of laminae. Further, a light emitting device has a plurality of LED elements disposed on a same plane, and a wavelength conversion portion that comprises a flat transparent base member that is disposed opposite to the plurality of LED elements and a phosphor layer that is of a phosphor to be excited by light emitted from the LED element and is formed like a film on the base member. The phosphor layer includes part with no phosphor in plane.

Light emitting device with wavelength converted by phosphor

Growing community of inventors

Aichi-ken, Japan

Hideaki Kato