Tokyo Electron Limited

Hideaki Kashiwagi

Norihisa Koga

Masashi Enomoto

Takafumi Niwa

Naoto Nakamura

An apparatus includes: an capturing part that captures a peripheral edge portion of a substrate including a reference substrate and a workpiece substrate, so as to acquire captured images of the reference and workpiece substrates; a first calculation part that calculates a theoretical peripheral edge position of the reference substrate in the captured image of the reference substrate with reference to a center thereof; a second calculation part that calculates a theoretical peripheral edge position of the workpiece substrate in the captured image of the workpiece substrate based on the theoretical peripheral edge position of the reference substrate and the captured image of the workpiece substrate; a setting part that sets processing parameters for the peripheral edge portion of the substrate based on the theoretical peripheral edge position of the workpiece substrate; and a processing part that processes the peripheral edge portion of the substrate based on the processing parameters.

Peripheral edge processing apparatus, peripheral edge processing method, and computer-readable recording medium

An auxiliary exposure apparatus is for performing auxiliary exposure of applying light of a predetermined wavelength from a laser light source to a resist film on a wafer, separately from exposure processing of transferring a pattern of a mask to the resist film applied on the wafer. The auxiliary exposure apparatus includes a first total reflection mirror that reflects the light from the laser light source toward the wafer; and an imaging device including a light receiving part that receives light after reflected by the wafer.

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Koshi, Japan

Hideaki Kashiwagi