Panasonic Intellectual Property Management Co., Ltd.

Hideaki Hyuga

Masanori Suzuki

Toru Hirano

Yoji Urano

Akifumi Nakamura

Jun Goda

Hayato Ioka

Ryoji Imai

Kenichiro Tanaka

Yoshihiko Kanayama

Naoki Tomoda

Teruhisa Yokota

A lighting apparatus includes: a projection lens; a light source behind the projection lens; a reflector that reflects light from the light source toward the projection lens; and a shield that blocks a portion of the light reflected by the reflector to form a cutoff line in a distribution pattern of the light. A textured section demarcated by unit regions is formed on a surface of the projection lens, and when a region in a center of the projection lens is defined as a central region, and regions left and right of the central region are defined as left and right regions, respectively, in a front view, a proportion of the unit regions in the central region is greater than a proportion of the unit regions in each of the left region and the right region.

Lighting apparatus, automobile, and projection lens

An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.

LED module and method of preparing the LED module, lighting device

A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.

Light-emitting device

The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.

LED module

Growing community of inventors

Osaka, Japan

Hideaki Hyuga