Hitachi High-tech Instruments Company, Ltd.

Sanyo Electric Co., Ltd.

Hideaki Fukushima

Akira Aoki

Kazuyoshi Oyama

Makio Kameda

Katsuyuki Seto

Akihiro Kawai

Kazuyoshi Ieizumi

Yoshiharu Fukushima

Takuya Imoto

Takashi Yoshii

Yoshihara Fukushima

Shuji Nushiyama

Yoshinori Ikeda

Kunimune Komaike

Shigeru Kuribara

The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.

Method of mounting electronic component

Electronic component mounting method

An electronic component mounting apparatus is configured to adjust a positional relationship between two axes when an error occurs in the positional relationship between the axes when a beam is moved by two drive sources. According to movement of the beam for component picking and mounting operations, linear scale signals from linear scale reading heads are inputted to a Ydriver and a Ydriver, respectively. Each of the Ydriver and the Ydriver calculates a difference between positions of the drive axes of the beam and controls a moving member of a linear motor based on the difference so as to increase thrust of one drive axis when the one drive axis is in a more backward position than another drive axis and to reduce the thrust of one drive axis when the one drive axis in a more forward position than another drive axis.

Electronic component mounting apparatus

A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The recognition processing is performed using the component data of group 1 data, group 2 data, group 3 data, and group 4 data that are stored for the images taken in a random access memory (RAM). The group 1 data is used for lead inspection (for inspecting positioning error and bending of the lead), the group 2 data and the group 3 data are used for calculating amounts of adjustment in the X and Y directions, and the group 4 data is used for calculating the amount of adjustment in the &thgr; direction. This makes it possible to mount accurately components with pins and extrusions extruded from the molding, such as connectors, such that the pins and extrusions are accurately engaged with the holes formed in a print board.

Apparatus for mounting electronic components

There is provided an electronic component-recognizing device for taking an image of an electronic component brought to a component-sensing station, for recognition thereof. The component-sensing camera takes the image of the electronic component by utilizing reflected light from the electronic component. A lighting mechanism lights the electronic component. The lighting mechanism comprises a light-guiding element, a ring light guide, and a light source. The light-guiding element is arranged annularly such that the light-guiding element can diffuse illumination light and emit the diffused illumination light toward the electronic component obliquely from below. The ring light guide holds the light-guiding element. A light source supplies the illumination light to the light-guiding element.

Electronic component-recognizing device

There are provided a component suction site-teaching system and method for an electronic component-mounting apparatus including a vacuum nozzle having a nozzle end face for picking up an electronic component thereat by vacuum. The vacuum nozzle is moved in directions of X axis and Y axis. An image of the electronic component set at a pickup position is taken. A graphical image of the nozzle end face of the vacuum nozzle is created from shape data of the vacuum nozzle. The image of the electronic component taken by the image taking means and the graphical image of the nozzle end face created by the image creating means, are displayed on a screen such that the graphical image of the nozzle end face is superimposed on the image of the electronic component. The image of the electronic component and the graphical image of the nozzle end face are moved relative to each other on the screen of the display means, thereby effecting alignment of the graphical image of the nozzle end face with an image of a predetermined site of the electronic component. A location of the predetermined site of the electronic component the image of which has been aligned with the graphical image of the nozzle end face by the image control means, is taught to nozzle moving means for moving the vacuum nozzle, as a location of a suction site of the electronic component to be sucked by the vacuum nozzle.

Component suction site-teaching system and method

Growing community of inventors

Gunma, Japan

Hideaki Fukushima