Kureha Kagaku Kogyo Kabushiki Kaisha

Hideaki Doi

Teruo Sakagami

Naohiro Murayama

Shunzo Endo

Takayuki Katsuto

Kenichi Kokubun

An optical material of a high refractive index is formed of a copolymer obtained by polymerizing 10-90 wt. % of a monomer represented by the following formula (I) and 90-10 wt. % of a monomer copolymerizable with the first-mentioned monomer. ##STR1## wherein R is a hydrogen atom or methyl group.

Optical material formed by casting polymerization of a phenyl phosphine

An optical material of a high refractive index is formed of a copolymer obtained by copolymerizing 3-40 wt. % of 4-isopropenylbiphenyl, 30-97 wt. % of a monofunctional aromatic monomer represented by the following formula (I) or (II) and 0-67 wt. % of another monomer copolymerizable with 4-isopropenylbiphenyl and the monofunctional aromatic monomer. ##STR1## wherein R means a hydrogen atom or methyl group, X denotes ##STR2## in which n stands for an integer of 0-3, Y is a halogen atom other than a fluorine atom, or a methyl, hydroxyl or methoxy group, and m stands for an integer of 0-3, with the proviso that Y may be different from each other when m is 2 or 3.

Optical material

The photoresist material comprises a polymer having chloromethyl groups introduced therein and containing 2-isopropenylnaphthalene as one component, an average substitution degree of the chloromethyl groups based on the polymer is within a range of 0.2 to 5. The photoresist material has a high glass transition point, a high sensitivity to radiation and an excellent dry etching resistance, whereby it is suitably used for the manufacture of a semiconductor element using radiation and provides a good resolution on etching.

Photoresist material

A laminar thermoplastic resin structure comprising a plurality of thermoplastic resin layers is obtained by bonding thermoplastic resin layers with a layer, or layers, of a maleic acid-modified block copolymer of a conjugated diene and an aromatic vinyl monomer interposed therebetween. The laminar structure thus obtained possesses a high bonding strength at elevated temperatures, and also excellent processability since the bonding layer per se is of thermoplastic nature. Thus, this laminar structure is particularly suitable as a material for use at elevated temperatures, for example, a packaging material for retort sterilization or a pipe for conducting hot fluids.

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Matsudo, Japan

Hideaki Doi