Hitachi, Ltd.

Kabushiki Kaisha Sega Enterprises

Hitachi Video Engineering, Incorporated

Hideaki Doi

Yuji Takagi

Chie Shishido

Takanori Ninomiya

Masahiro Watanabe

Takashi Hiroi

Yasuhiko Hara

Shunji Maeda

Makoto Ono

Maki Tanaka

Mari Nozoe

Haruo Yoda

Yasutsugu Usami

Aritoshi Sugimoto

Asahiro Kuni

Atsuko Takafuji

Koichi Karasaki

Hiroyuki Shinoda

Mineo Nomoto

Akira Sase

Hiroya Koshishiba

Tadashi Iida

Shuji Maeda

Yoko Irie

Minori Noguchi

Toshifumi Honda

Hidetoshi Nishiyama

Yoshimasa Ohshima

Kenji Watanabe

Masataka Shiba

Yukio Kembo

Yasuo Nakagawa

Susumu Aiuchi

Hiroshi Morioka

Yuzo Taniguchi

Hirohito Okuda

Kazushi Yoshimura

Yukio Matsuyama

Kazuhiko Matsuoka

Mitsunobu Isobe

Kozo Nakahata

Keiichi Okamoto

Yoshiharu Shigyo

Hisae Yamamura

Fumiaki Endo

Shigeshi Yoshinaga

Satoshi Shinada

Yoko Suzuki

Yasuhiro Fujishita

Haruomi Kobayashi

A pattern inspecting method and apparatus for inspecting a defect or defective candidate of patterns on a sample includes picking up an image of a sample by shifting a sampling position on the sample, measuring geometric distortion in an image of a standard sample, beforehand, and defining a size for which the measured geometric distortion is neglectable, obtaining a first image of the sample and a second image to be compared with the first image, dividing the first image and the second stage into images of a division unit having a size not greater than the defined size, comparing a divided image of the first image with a divided image of the second image, and for calculating a difference in gradation values between both of the divided images. The defect or the defect candidate of the sample is extracted in accordance with the difference in the gradation values.

Pattern inspecting method and apparatus thereof, and pattern inspecting method on basis of electron beam images and apparatus thereof

In order to provide a high-speed, inexpensive inspection system that has a short development period, that is flexible, and that allow algorithms to be easily changed, a PC equipped with an image input feature is used to capture an image detected by a line image sensor, this detected image is transferred to a plurality of PCs connected by a LAN, and defects are detected using software processing on the plurality of PCs.

Inspection system for circuit patterns and a method thereof

A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.

Semiconductor device producing method, system for carrying out the same and semiconductor work processing apparatus included in the same system

With a view to providing a monitoring system for the quality and manufacturing conditions of electronic circuits capable of facilitating the grasping of correlation's between diverse manufacturing conditions and manufacturing states, statistically characteristic images are selected out of a group of images retrieved from a detection information database by specifying at least one out of the values of feature quantities, design information and manufacturing conditions, and are displayed.

Method monitoring a quality of electronic circuits and its manufacturing condition and system for it

For purpose of providing a defect inspecting method and an apparatus thereof and a defect inspecting method on basis of electron beam image and an apparatus thereof, reducing possibility of bringing erroneous or false reports due to the test objection side and the inspecting apparatus side, being caused by discrepancies, such as the minute difference in pattern shapes, the difference in gradation values, the distortion or deformation of the patterns, the position shift, thereby enabling the detection of the defects or the defective candidates in more details, wherein an image which is small in distortion by controlling the electron beam scanning is detected and divided into a size so as to be able to neglect therefrom, and then position shift detection and defect decision are carried out in an accuracy less or finer than pixel for each division unit. In the defect decision, a desired tolerance can be set up depending upon changes in gradation values and the position shift.

The present invention relates to a method and system of inspecting a product, including extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection. The method and system is characterized in that the extracted feature data of the defects is fed back for inspecting the product. The present invention also relates to a method of manufacturing a semiconductor electric or electronic device, including extracting defects from the semiconductor electric or electronic device, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data on the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects to an apparatus for manufacturing the semiconductor electric or electronic device.

Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices

A method for inspecting a pattern formed on a substrate, includes the steps of moving a table along a first direction on which a substrate to be inspected is mounted, irradiating a converged electron beam on the substrate by scanning the converged electron beam along a second direction which is perpendicular to the first direction; detecting an electron radiated from the substrate by the irradiation of the converged electron beam in which the movement of the table and the scanning of the converged electron beam are synchronized; forming a digital image of the substrate from the detected electron; improving a quality of the digital image by filtering the digital image; and detecting a defect of a pattern formed on the substrate by using the improved quality digital image.

Method of inspecting a pattern on a substrate

A three-dimensional imaging system provides an image display system, a method and a recording medium, whereby a three-dimensional display of virtual images causes an observer to perceive virtual images three-dimensionally at a part of the body, such as the hand, of the observer. The system includes, for example, a position detecting unit detecting unit detecting the position in real space of a prescribed part of the body of an observer viewing the virtual images, and outputs the spatial coordinates thereof. A display position determining unit determining unit determines the positions at which the observer is caused to perceive the virtual images, on the basis of ages, on the basis of the spatial coordinates output by the position detecting unit.

Three-dimensional imaging system, game device, method for same and recording medium

A method and apparatus for inspecting a pattern, a first image of a first area on a sample is acquired by imaging the first area formed as a first pattern, and the first image is memorized. A second image of a second area on the sample is acquired by imaging the second area formed as a second pattern which is to be the same as the first pattern. A defect of the first pattern is detected by acquiring a differential image between the first image and the second image. The detection of the defect includes processing the differential image by using information of brightness corresponding to both of the first image and the second image.

Method of inspecting pattern and apparatus thereof with a differential brightness image detection

In a method of inspecting a defect and an apparatus thereof, an allowable range for a gradation value of a difference image is determined for each pixel from one pixel or less of position shift quantity between two images to be compared, a variation rate in a local gradation value of an image, and a representative value of the local gradation value. Then, by comparing the gradation value of the difference image with the allowable range determined for each pixel, a pixel, on which the gradation value of the difference image is within the allowable range, is judged to be an non-defective candidate and a pixel, on which the gradation value of the difference image is beyond the allowable range, is judged to be a defective candidate. This reduces the number of false information caused by mismatches attributed to an object to be inspected and an image detecting system, such as an infinitesimal difference in pattern configuration, a difference in the gradation value, a distortion of a pattern, and a position shift, thus making it possible to detect a more minute defect.

Method of inspecting pattern and apparatus thereof

A three-dimensional shaped defect inspecting method including a three-dimensional shape detection region selecting step for detecting a two-dimensional picture signal by taking a two-dimensional optical picture fluorescence emitted from a detection object and selecting a three-dimensional shape detection region in respect of the detection object based on the detected two-dimensional picture signal, and a three-dimensional shape determining step for detecting a picture signal by taking an optical picture in accordance with a height by reflected light from the detection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape inspection region with respect to the detected picture signal, thereby calculating and determining a three-dimensional shape, whereby a defect caused by a deficiency in thickness or the like on a wiring pattern of a solid shape, formed on a detection object of a circuit board or the like, can be detected in a short period of time, and its device.

Method and device of inspecting three-dimensional shape defect

A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.

Wiring pattern inspecting method and system for carrying out the same

The present invention relates to a method and system of inspecting a product, including extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection. The method and system is characterized in that the extracted feature data of the defects is fed back for inspecting the product. The present invention also relates to a method of manufacturing a semiconductor electric or electronic device, including extracting defects from the semiconductor electric or electronic device, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects to an apparatus for manufacturing the semiconductor electric or electronic device.

Method and system for manufacturing semiconductor devices, and method

An X-ray inspection apparatus and method in which an object to be inspected is irradiated with characteristic X-rays containing at least one wavelength which affords a high X-ray absorbance in the object to be inspected. A transmitted X-ray image which has passed through the object to be inspected is detected, and the object to be inspected is inspected on the basis of the transmitted X-ray image. The method and apparatus are utilized to fabricate a multi-layer printed circuit board.

X-ray inspection method and apparatus, prepreg inspecting method, and

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Oota-ku, Japan

Hideaki Doi