Japan Display Inc.

Kabushiki Kaisha Toshiba

Mitsubishi Denki Kabushiki Kaisha

Hitachi Displays, Ltd.

Mitsubishi Electric Engineering Company, Limited

Renesas Technology Corp.

Hitachi, Ltd.

Other

Renesas Electronics Corporation

Sony Corporation

Nec Corporation

Panasonic Liquid Crystal Display Co., Ltd.

Hitachi Device Engineering Co., Ltd.

Nippon Electric Co., Ltd.

Ips Alpha Technology, Ltd.

Hideaki Abe

Akira Yamazaki

Katsumi Dosaka

Yasuhiro Konishi

Masaki Kumanoya

Hisashi Iwamoto

Kouji Hayano

Yasuhiro Ishizuka

Katsumitsu Himukashi

Kenji Hirose

Yasushi Nakano

Junichi Nishimoto

Hitoshi Kawaguchi

Keisuke Asada

Tadashi Hoshi

Midori Nagayama

Tsukasa Saiki

Kazuyuki Yamada

Youhei Iwai

Kota Uogishi

Mitsuru Goto

Yuichiro Yamazaki

Kazunari Inoue

Ryouhei Suzuki

Hiroyuki Onodera

Yasuhito Aruga

Makoto Sato

Hiroki Kato

Yoichi Miyajima

Tetsuro Nakasugi

Hironobu Abe

Shinji Tanabe

Takayuki Noguchi

Masumi Iohara

Yuri Okumura

Koji Yamashita

Koji Nii

Nobuhiro Maki

Toshio Nakano

Yuri Hiraiwa

Hiroshi Watanabe

Motosuke Miyoshi

Setsuo Kobayashi

Takeo Miki

Kazuyoshi Sugihara

Kazunari Kurokawa

Tadashi Mitsui

Hiroshi Ito

Kenichi Oyamada

Hiroko Hayata

Kenichi Takemasa

Kazunori Ojima

Yasuaki Kondo

Kouichi Inoue

Akiya Izumi

Hiroshi Motoki

Daiki Isono

Yuji Yano

Masayuki Yanagihara

Masahiko Kadowaki

Keiichi Sakata

Yuuichiro Yamazaki

Masahiro Inoue

Yoshinori Niwata

Tunehisa Horiuchi

Masaakii Hosouchi

Satoshi Namiki

Tsukasa Saika

Noboru Kataoka

An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.

LED module

To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.

Display device and electronic device

According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.

Electronic device

An LED module includes a first protrusion and a second protrusion adjacent to the first protrusion arranged on an insulating surface, a first electrode arranged on the first protrusion, and a second electrode arranged on the second protrusion, and an LED chip arranged on upper sides of the first protrusion and the second protrusion. The LED chip is connected to the first electrode and the second electrode via conductive members, and the first protrusion and the second protrusion are insulative and have a height of 1 μm to 50 μm.

LED module and display device having led module

An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.

Display device

According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.

Display device, flexible wiring board, and manufacturing method of display device

A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

Display device and wiring substrate

An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

A display device includes a substrate, a first pixel region including a first light emitting element group over the substrate, a second pixel region including a second light emitting element group over the substrate and adjacent to the first light emitting element group, and a partition wall between the first light emitting element group and the second light emitting element. A height of the partition wall is larger than heights of a plurality of emitting elements included in each of the first light emitting element group and the second light emitting element group.

The purpose of the invention is to counter measure a disconnection between the driver IC and the terminal when the terminal area of the electronic device is curved. One of the structures is as follows. An electronic device comprising: a driver IC installed in a terminal area, the terminal area being curved, wherein the driver IC has a circuit and plural bumps, the driver IC has a tapered portion formed on an opposite surface from a surface that the plural bumps are formed, the tapered portion overlaps with an outer most bump of the plural bumps.

Electronic device and manufacturing method thereof and manufacturing method of driver IC

An electronic device includes a substrate including an input terminal arranged a plurality of terminals, a wiring substrate having a flexibility connected to the input terminal part. The wiring substrate includes a base film, a cover film covering the base film, a plurality of wirings between the base film and the cover film, a connection part, and a first region bent in a first the one side and a second region adjacent to the first region. The second region of the connection part includes a first connection terminal group connected to the plurality of wirings, a second connection terminal group, and a dummy terminal group between the first connection terminal group. The first region is provided with an opening through the base film and the cover film, the second region overlaps the input terminal part, and the dummy terminal group and the opening are adjacent to each other.

Electronic device, display device, and method for manufacturing thereof

Growing community of inventors

Tokyo, Japan

Hideaki Abe