Syndiant Inc.

Xdmicro (zhongshan) Optoelectronic Semiconductor Co., Ltd.

Hiap Liew Ong

Chun Chiu Daniel Wong

Min Hwang Michael Lyu

Liming Wang

A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.

Manufacturing method of micro LED display module

A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Manufacturing method of micro LED display module having light transmissive substrate

Micro LED display module

Micro LED display module having light transmissive substrate

The present invention provides a method of unit level liquid crystal display device assembly process for liquid crystal on silicon. It starts with sawing silicon wafer and ITO glass substrate. Then good silicon dies and ITO glass dies will be picked and transferred to separate carriers. Alignment layers will respectively be coated on each silicon die and ITO glass die after cleaning. Then there are two options for the following steps. In method one, silicon die and ITO glass die lamination comes after coating frame adhesive. Then frame adhesive is cured. The liquid crystal will fill the cell and then seal the fill port. Die mounting, wire bonding and encapsulation will come along with external ITO connection to call it an end. In method two, frame adhesive precedes internal connection and LC one drop fill. Then silicon die and ITO glass die are laminated before frame adhesive cure. Afterwards die mount, wire bonding and encapsulation come last.

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Southlake, TX, United States of America

Hiap Liew Ong