Hyundai Motor Company

Hi Won Lee

Hyun Soo Kim

Dong Gu Kim

Il Seon Yoo

Yong Sung Lee

Soon Myung Kwon

A MEMS sensor and a manufacturing method thereof is provided: forming a lower electrode layer wherein a metal is deposited on a portion of a lower glass substrate; forming a structural layer by etching according to a pattern which is formed on an upper surface of a silicon wafer and then further etching to the same thickness as the metal which is formed on a portion of the lower electrode layer; anodic bonding the structural layer to an upper portion of the lower electrode layer formed; forming a sensing part in the structural layer by etching according to a pattern which is formed on an opposite surface of the structural layer which is not etched; and forming an upper electrode layer by depositing a metal on an upper wafer and eutectic bonding the upper electrode layer to the structural layer on which the sensing part is formed.

Wafer level package of MEMS sensor and method for manufacturing the same

Disclosed herein is a torque sensor. The torque sensor includes a cylindrical upper case having one open end and an overload prevention member that is fixed to the upper case to prevent overload. A lower case covers the open end of the upper case and an elastic structure member is disposed on the lower case to detect deformation. Additionally, a silicon structure member is disposed on the elastic structure member to detect deformation.

Growing community of inventors

Seoul, South Korea

Hi Won Lee