Samsung Electronics Co., Ltd.

Hi-choon Lee

Young-Yong Byun

Sang-Hyuk Kwon

Chul-Hwan Choo

Jin-hyung Cho

Seung-hoon Lee

Dong-jin Lee

Hyung-Dong Kim

Su-a Kim

Yong-sik Seok

Ga-pyo Nam

Won-chang Jung

Chris Ji Yoon Son

A high voltage generating circuit may include a pulse signal generator, a counter, a plurality of transmitters, and/or a plurality of pumpers. The pulse signal generator may be configured to be enabled in response to a refresh command signal to output a pulse signal. The counter may be configured to count the pulse signal and sequentially output a plurality of selection signals. The plurality of transmitters may be configured to be sequentially enabled in response to individual selection signals of the plurality of selection signals to transmit the pulse signal. The plurality of pumpers may correspond to the plurality of transmitters. Each of the plurality of pumpers may be configured to collectively generate a high voltage based on the transmitted pulse signal from a corresponding transmitter of the plurality of transmitters.

High voltage generating circuit and semiconductor memory device having the same and method thereof

A semiconductor chip package and a semiconductor chip fabricating method are provided. A semiconductor chip package comprises at least two semiconductor chips having a stacked configuration, the semiconductor chips at least one of: sharing DC signals of DC generating circuits provided by one of the semiconductor chips; and sharing a DLL clock signal of a DLL circuit provided by the semiconductor chip having the DC generating circuits or provided by another semiconductor chip. Power consumption can be reduced, and sharing a DLL clock is valid. In addition, a stabilized DC supply can be guaranteed and an increase for level trimming range and productivity can be improved.

Stacked semiconductor chip package with shared DLL signal and method for fabricating stacked semiconductor chip package with shared DLL signal

A test circuit and method for use in a semiconductor memory device is provided. The test method for use in a semiconductor memory device including a plurality of memory blocks may include sequentially enabling a plurality of word lines by applying a stress to the wordlines and performing a test operation, in response to sequentially applied test addresses, each of the word lines being sequentially selected from the plurality of memory blocks and enabled.

Test circuit and method for use in semiconductor memory device

A word line driver for use in a semiconductor memory device includes a boosted voltage generator, a sub word line driver and a main word line driver. The boosted voltage generator generates a boosted voltage by receiving an internal power supply voltage and pumping electric charge. The sub word line driver receives the internal power supply voltage and activates a boosted voltage control signal after supplying the internal power supply voltage to a boost node in a command operating mode. The main word line driver enables a word line by supplying the boosted voltage to the boost node in response to the boosted voltage control signal in a normal operating mode, and enables the word line with the boosted voltage after boosting the word line to the internal power supply voltage by changing the boost node from the internal power supply voltage to the boosted voltage in the command operating mode.

Word line driver and semiconductor memory device having the same

A semiconductor memory device and method thereof are provided. The example semiconductor memory device may include a plurality of comparators receiving output data signals from each of a plurality of sub-array blocks, comparing the output data signals from each of the plurality of sub-array blocks and outputting a plurality of comparison result signals and a test circuit receiving the plurality of comparison result signals from the plurality of comparators, respectively, the test circuit configured to selectively output one of a given one of the plurality of comparison result signals on a given data input/output pad and a given signal obtained by performing a logical operation on at least two of the plurality of comparison result signals on the given data input/output pad in response to a select signal.

Semiconductor memory device and method thereof

A semiconductor memory device may include a memory cell array and at least one fuse box. The memory cell array may include a plurality of sub-array blocks, and a fuse box may include a plurality of fuse groups, each group corresponding to a sub-array block. Each fuse group may have a plurality of fuses, wherein the fuses are intermittently arranged such that fuses of the same fuse group are not adjacent to each other. Each fuse group may further include a master fuse and a fuse mode determining circuit for determining a fuse-on-mode or a fuse-off-mode for the repair operation of a sub-array block. Consequently, during a repair operation using a conventional laser having a relatively large beam spot, the designated fuse of one fuse group as well as adjacent fuses of a different group may be cut without hindering the repair operation of the sub-array block. Accordingly, increasing the pitch size of the fuses to accommodate the relatively large beam spot of a conventional laser may not be necessary, thus allowing a reduction in the size of the fuse box (and the overall semiconductor memory device). Additionally, the above fuse arrangement may reduce costs by permitting the use of conventional laser equipment instead of more expensive laser equipment having a relatively small beam spot.

Method of arranging fuses in a fuse box of a semiconductor memory device and a semiconductor memory device including such an arrangement

A semiconductor device for generating a test voltage for a wafer burn-in test and method thereof is disclosed. To generate the test voltage for a wafer burn-in test, a control signal may be generated in response to a supply voltage from an external wafer burn-in test device. A supplementary voltage may be generated in response to the control signal by using an internal voltage driving circuit. The test voltage may be generated by combining the supply voltage and the supplementary voltage.

Semiconductor device generating a test voltage for a wafer burn-in test and method thereof

A delay-locked loop (DLL) circuit includes a standby signal generating circuit, a front stage circuit, and a back stage circuit. The standby signal generating circuit generates a first standby signal and a second standby signal in response to an active signal, a crock enable signal, a first column address strobe (CAS) latency signal, and a second CAS latency signal. The front stage circuit compares the phase of an external clock signal and the phase of a feedback signal and delays the external clock signal based on the phase difference between the external clock signal and the feedback signal to generate a first clock signal. The back stage circuit executes interpolation and duty-cycle correction on the first clock signal.

Delay-locked loop circuit of a semiconductor device and method of controlling the same

A semiconductor memory device and a read data skew control method thereof, in which a point of time when read data is output can he controlled using pad bonding in stack packages. The semiconductor memory device includes a bonding option pad and a delay control circuit that controls the point of time when data is output from an output buffer depending on logic states of a signal applied to the bonding option pad. Thus, when using the semiconductor memory device in stack packages, the read data skew generated as a result of a load on a bonding wire can be compensated by connecting the bonding option pad to ground voltage or a supply voltage.

Semiconductor memory device for stack package and read data skew control method thereof

A semiconductor memory device and multi-row address test method reduce the time it takes to perform the multi-row address test. The semiconductor memory device comprises normal memory cell blocks, which can include normal memory cells and spare cells that replace defective cells. The device also includes a redundancy signal generator to output a redundancy signal indicating whether any memory cell blocks include defective cells and address signals of repair word lines corresponding to the defective cells. A redundancy signal decoder decodes the redundancy signal and the address signals of the repair word lines and outputs word line enable signals, and word line drivers that do not enable the repair word lines, but selectively enable the normal word lines in response to the word line enable signals.

Semiconductor memory device with reduced multi-row address testing

Disclosed herein is a semiconductor memory device having a pair of local data lines with a delayed precharge voltage application point. The semiconductor memory device of the present invention includes a delay block for delaying the activation time of a block write control signal, thus lengthening the interval starting from the time when data on a pair of bit lines are amplified to the time when a supply voltage is applied to a pair of local data lines. Therefore, according to the semiconductor memory device of the present invention, the time when the supply voltage is applied to the pair of local data lines is the time after data have sufficiently stabilized on the pair of bit lines. Therefore, the semiconductor memory device of the present invention prevents the stabilization speed of the pair of bit lines and the pair of local data lines from decreasing, thus consequently improving the operating speed of the semiconductor memory device.

Semiconductor memory device having local data line pair with delayed precharge voltage application point

A redundancy circuit is used to repair a normal column containing a defective normal memory cell. The redundancy circuit comprises a redundancy column containing redundancy memory cells and a plurality of programmable decoders. When any one of the plurality of programmable decoders enters a repair mode, a column pre-decoder for selecting a column containing a normal memory cell is disabled. Each of the programmable decoders can be configured to replace a column containing a defective normal memory cell in a single memory bank or a single memory bank group with a redundancy column. Since a defective column is replaced with a redundancy column in individual banks or bank groups, redundancy efficiency is greatly improved by allowing multiple normal columns containing defective cells to be replaced using a single redundancy column.

Semiconductor memory device having redundancy circuit capable of improving redundancy efficiency

A semiconductor memory device having a structure in which a data input/output line is shared by a plurality of banks is provided. In the semiconductor memory device which has a memory block including a plurality of banks, data of a selected memory cell is input or output via a data input/output line. When data is written to a memory cell, the memory block is divided into at least two bank groups and the data input/output line is divided into at least two data input/output lines to separately connect the data input/output line to the respective bank groups so that the data is written to the selected memory cell via the data input/output line connected to a bank group including the selected memory cell. When data of a selected memory cell is read, the local data input/output lines are connected. Therefore, reduction of speed and power consumption is minimized and loads of data input/output lines are regulated during the read and write operations.

Semiconductor memory device having data input/output line shared by a plurality of banks

An internal power supply generating circuit for a semiconductor memory device reduces fluctuations in the external power supply by reducing the rate at which a drive transistor is turned on and off. The circuit includes a drive transistor that generates an internal power signal by reducing the external power supply voltage responsive to a bias signal. A feedback loop generates the bias signal and slows down the rate at which the bias signal changes, thereby reducing the rate at which the drive transistor turns on and off. The feedback loop includes a comparator for comparing the internal power supply voltage to a reference voltage and a bias circuit having a pair of push-pull transistors for generating the bias signal responsive to the output of the comparator. To slow down the rate at which the bias signal changes, the bias circuit includes a resistor coupled in series with the transistors and/or a capacitor couple to the output terminal of the bias circuit. Alternatively, the bias circuit includes a third transistor coupled in series with the push-pull transistors. A voltage divider is coupled to the gate of the third transistor and the gate of one of the push-pull transistors to turn the third transistor on. The feedback loop optionally includes a delay circuit to prevent malfunctions caused by the differences in voltage associated with sensing the internal power supply voltage at remote locations on a memory device.

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Yongin-si, South Korea

Hi-choon Lee