Xiamen Changelight Co., Ltd.

Hexun Cai

Zhiwei Lin

Junxian Li

Kaixuan Chen

Yingce Liu

Zhendong Wei

Xingen Wu

Qilong Wu

Yang Wang

Hongyi Zhou

Xinmao Huang

Bin Song

Lihe Cai

Yongtong Li

Qimeng Lyu

Gengcheng Li

A light-emitting diode (LED) chip () comprises a substrate (), an epitaxial structure (), a transparent conductive layer (), a passivation protective layer (), and at least one electrode (). The epitaxial structure () is disposed on the substrate (). The transparent conductive layer () is disposed on the epitaxial structure (). The transparent conductive layer () defines one or more first through holes () that extend through the transparent conductive layer (). The passivation protective layer () is disposed on the transparent conductive layer (). The passivation protective layer () defines one or more second through holes () that extend through the passivation protective layer (). The electrode () is disposed on the passivation protective layer (). The electrode () electrically connects the transparent conductive layer () through the one or more second through holes ().

Light-emitting diode chip and method of manufacturing the same

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Fujian, China

Hexun Cai