Samsung Electronics Co., Ltd.

Heungkyu Kwon

Taehwan Kim

Ji-Hyun Park

Heeseok Lee

Jae Choon Kim

Jichul Kim

Min-Ok Na

Eunseok Cho

Junso Pak

JaeWook Yoo

Su-Chang Lee

Kyoungmook Lim

Yongchul Choi

Seungjin Cheon

Kang Joon Lee

Sangho An

Inhyuk Kim

Jungcheon Choi

JeongOh Ha

Provided is a semiconductor package system. The system includes a substrate, a first semiconductor package on the substrate, a second semiconductor package on the substrate, a first passive element on the substrate, a heat dissipation structure on the first semiconductor package, the second semiconductor package, and the first passive element, and a first heat conduction layer between the first semiconductor package and the heat dissipation structure. A sum of a height of the first semiconductor package and a thickness of the first heat conduction layer may be greater than a height of the first passive element. The height of the first semiconductor package may be greater than a height of the second semiconductor package.

Semiconductor package system

An electronic device mounted in a vehicle and including; a temperature sensor configured to measure a temperature associated with a measurement target to generate a measured temperature, and a controller configured to operate in a normal operating mode if the measured temperature is less than a first reference temperature, and further configured to operate in a limited control mode if the measured temperature is greater than or equal to the first reference temperature. During the normal operating mode, the controller is enabled to perform a performance limiting function, and during the limited control mode, the controller is enabled to perform an emergency call (eCall) function and is disabled to perform a performance limiting function.

Electronic device and operating method

A hybrid semiconductor device includes an interposer substrate, a semiconductor package mounted on the interposer substrate, a molding member on the package substrate covering at least a portion of the semiconductor chip and exposing an upper surface of the semiconductor chip, and a stiffener disposed on an upper surface of the interposer substrate substantially around the semiconductor package.

Hybrid semiconductor device and electronic device

A semiconductor package includes; a dual stiffener including an upper stiffener and a lower stiffener, an upper package including an upper package substrate, a semiconductor chip centrally mounted on an upper surface of the upper package substrate, and the upper stiffener disposed along an outer edge of the upper package substrate, and a lower package substrate that centrally mounts the upper package and includes the lower stiffener disposed on an upper surface of the lower package substrate to surround the upper package substrate.

Semiconductor package including dual stiffener

A semiconductor package system includes a substrate, a first and a second semiconductor package, a first thermal conductive layer, a first passive device, and a heat radiation structure. The first and second semiconductor package and first passive device may be mounted on a top surface of the substrate. The first semiconductor package may include a first semiconductor chip that includes a plurality of logic circuits. The first thermal conductive layer may be on the first semiconductor package. The heat radiation structure may be on the first thermal conductive layer, the second semiconductor package, and the first passive device. The heat radiation structure may include a first bottom surface physically contacting the first thermal conductive layer, and a second bottom surface at a higher level than that of the first bottom surface. The second bottom surface may be on the second semiconductor package and/or the first passive device.

A semiconductor module may include a system board including a top surface and a bottom surface, a module substrate provided on the top surface of the system board, a system semiconductor package mounted on the module substrate, and first and second power management semiconductor packages mounted on the module substrate. The first and second power management semiconductor packages may be spaced apart from each other in a first direction, which is parallel to a top surface of the module substrate, with the system semiconductor package interposed therebetween.

Semiconductor module including multiple power management semiconductor packages

Disclosed is a semiconductor package system comprising a substrate, a first semiconductor package on the substrate, and a heat radiation structure on the first semiconductor package. The heat radiation structure includes a first part on a top surface of the first semiconductor package and a second part connected to the first part. The second part has a bottom surface at a level lower than a level of the top surface of the first semiconductor package. A vent hole is provided between an edge region of the substrate and the first part of the heat radiation structure.

Provided is a semiconductor package. The semiconductor package may include a substrate, a semiconductor chip on the substrate, a passive element on the substrate, a conductive structure on the substrate, and an interposer substrate on the semiconductor chip, the passive element, and the conductive structure. The interposer substrate may be electrically connected to the conductive structure. A height of the passive element may be greater than a height of the semiconductor chip.

Semiconductor package

A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

Surface temperature management method of mobile device and memory thermal management method of multichip package

Provided are a package-on-package type semiconductor package and a method of fabricating the same. The semiconductor package includes upper package stacked on a lower package and a via provided between the lower and upper packages to electrically connect the lower and upper packages to each other. The lower package includes a lower package substrate, a lower semiconductor chip mounted on the lower package substrate, and a lower mold layer encapsulating the lower semiconductor chip and including an alignment mark. The lower mold layer includes a marking region, which is provided between the via and the lower semiconductor chip, and on which the alignment mark is provided.

Package-on-package type semiconductor package and method of fabricating the same

A chip includes a core layer, at least one redistribution layer formed on the core layer, and at least one triple pad connected to a pad of the core layer through the at least one redistribution layer or at least one via connected to the at least one redistribution layer. The at least one triple pad includes a bonding pad, a redistribution layer pad connected to the at least one redistribution layer, and a test pad configured to perform a wafer level test. The bonding pad, the redistribution layer pad and the test pad are connected to one another through the at least one redistribution layer, and the test pad is disposed in a core area that overlaps the core layer.

Chip using triple pad configuration and packaging method thereof

Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.

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Seongnam-si, South Korea

Heungkyu Kwon