Samsung Electro-mechanics Co., Ltd.

Electronics and Telecommunications Research Institute

Heung Woo Park

Jong Woon Kim

Won Kyu Jeung

Yeong Gyu Lee

Jung Gon Choi

Jung Won Lee

Tae Hyun Kim

Sung Jun Lee

Jae Hyun Lim

Seung Hun Han

Sung Min Song

Kang Hyun Lee

Chang Su Park

Jong Hyun Lee

Sang Kyeong Yun

Tae Joon Park

Yun Sung Kang

Yong Sung Eom

Sang Kee Yoon

Liwei Lin

Jong Tae Moon

Jung Eun Noh

Seung Heon Han

Jun Mo An

Jung Tae Park

Minyao Mao

Kwang Seong Choi

Jong Hyeong Song

Dong Ho Shin

Byung Seok Choi

Suk Kee Hong

Hyun Kee Lee

Jong Woo Han

Ohk Kun Lim

Yurlov Victor

Min Kyu Choi

Ho Gyeong Yun

Hyung Jae Park

An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.

Image sensor assembly, method of manufacturing the same, and camera module

An electronic module includes a first component, a second component, a spacer, and an adhesive portion. The first component includes a first surface. The second component is disposed to be spaced apart from the first surface by a distance of about 40 &#x3bc;m to about 200 &#x3bc;m. The spacer spaces the first component and the second component apart from each other. The adhesive portion is disposed between the first surface and a bonding surface of the spacer facing the first surface. The spacer includes an inner spacer having a ring shape, and an outer spacer surrounding the inner spacer and disposed spaced apart from the inner spacer by 50% or less of an overall width of the inner spacer and the outer spacer, and an overall width of the adhesive portion is 100% to 150% of the overall width of the inner spacer and the outer spacer.

Electronic module and method of manufacturing the same

An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.

Disclosed herein is a MEMS sensor module package. The MEMS sensor module package according to a preferred embodiment of the present invention includes: a printed circuit board (PCB); an application specific integrated circuit (ASIC) stacked on the PCB, one side of the ASIC being wire-bonded to the PCB; a MEMS sensor stacked on the ASIC; and a molding encapsulating the MEMS sensor and the ASIC with a resin. Accordingly, the electrical connection distance between a MEMS sensor and an ASIC is shortened so that electrical characteristic may be improved. Further, a sensor module package may be implemented in an ASIC size, so that size reduction may be achieved to meet the requirements of mobile devices.

Micro electro mechanical systems sensor module package and method of manufacturing the same

There are provided a microphone package and a mounting structure thereof, allowing for an increase in a back volume, the microphone package including: a package substrate; an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, wherein the package substrate includes an acoustic volume connecting the space of the acoustic element and the space of the electronic component.

Microphone package and mounting structure thereof

Disclosed herein is an inertial sensor including: a membrane; a mass body provided under the membrane; a plurality of patterned magnets provided under the mass body; and a magnetoresistive element provided to be spaced apart from the mass body and measuring static DC acceleration acting on the mass body through resistance changed according to magnetic fields of the plurality of patterned magnets. The plurality of patterned magnets and the magnetoresistive element are included, thereby making it possible to measure static DC acceleration (particularly, gravity acceleration) that is difficult to measure using an existing to piezoelectric element.

Sensor capable of measuring acceleration, angular velocity, and DC acceleration

Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensoraccording to a preferred embodiment of the present invention is configured to include a plate-shaped membrane, a mass bodydisposed under a central portionof the membrane, a postdisposed under an edgeof the membraneso as to support the membrane, and a bottom capof which the edgeis provided with the first cavityinto which an adhesiveis introduced, wherein the adhesivebonds an edgeto a bottom surface of the post, whereby the edgeof the bottom capis provided with the first cavityto introduce the adhesiveinto the first cavity, thereby preventing the adhesivefrom being permeated into the post

Inertial sensor and method of manufacturing the same

Disclosed herein is a method of manufacturing an inertial sensor using a polling method of a piezoelectric element performing a polling after packaging the piezoelectric element, the method of manufacturing an inertial sensor including: forming a driving electrode and a sensing electrode on a flexible substrate on which a piezoelectric material is deposited; electrically connection the driving electrode and the sensing electrode; packaging the flexible substrate; polling by applying voltage and heat to the driving electrode and the sensing electrode; and electrically separating the driving electrode from the sensing electrode by applying heat to the driving electrode and the sensing electrode.

Polling method of piezoelectric element and method of manufacturing inertial sensor

Disclosed herein is an inertial sensor including: a driving part displaceably supported by a support; a driving electrode vibrating the driving part; and a detecting electrode detecting a force acting on the driving part in a predetermined direction, wherein the driving part includes: a center driving mass positioned at the center of the inertial sensor; side driving masses connected to and interlocking with the center driving mass and positioned at four sides based on the center driving mass; and connection bridges connecting the center driving mass, the side driving masses, and the support to each other.

Inertial sensor and angular velocity detection method using the same

An inertial sensor includes a plate-like substrate layer, a mass body, a support frame, a limit stop extending in the central direction of the mass body from the support frame, and a detection unit detecting the displacement of the displacement part. The inertial sensor adopts the limit stop limiting the downward displacement of the mass body to prevent the support portion of the mass body from being damaged.

Inertial sensor

Disclosed herein is an inertial sensor. An inertial sensoraccording to a preferred embodiment of the present invention includes a plate-shaped membrane, a mass bodythat is provided under a central portionof the membraneand includes an integrated circuit, and a postthat are provided under an edgeof the membraneto surround the mass body, whereby the overall thickness and area of the inertial sensor can be reduced by including the integrated circuit in the mass bodyto implement a thin and small inertial sensor

Disclosed herein is a MEMS component. The MEMS component according to the exemplary embodiment of the present invention includes: a plate-shaped membrane; a postdisposed under an edgeof the membrane; a stopperdisposed under the membraneand disposed more inwardly than the postso as to form a spacebetween the stopperand the post; and a capdisposed under the postso as to cover the post, whereby the influence of disturbance or noise occurring from external environments or interference from surrounding sensors can be interrupted by using a predetermined regionof the membranedisposed above the space

Micro electro mechanical systems component

Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensorincludes (A) applying a polymerto a base substrate, (B) patterning the polymerso as to form an opening partin the polymer, (C) completing a capby forming a cavityon the base substrateexposed fro the opening partthrough an etching process in a thickness direction, and (D) bonding the capto a device substrateby using a polymer, whereby the polymeris applied to the base substratein a constant thickness D, such that the capmay be easily bonded to the device substrateby using the polymer

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Suwon-si, South Korea

Heung Woo Park