Samsung Electro-Mechanics Co., Ltd.

Posco

Research Institute of Industrial Science & Technology

Heung Soo Park

Kwang Soo Kim

Chang Hyun Lim

Seog Moon Choi

Joon Seok Chae

Sung Keun Park

Jung Eun Kang

Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Method of manufacturing a hybrid heat-radiating substrate

Disclosed is a multi band chip antenna with dual feeding ports formed on a radiation electrode structure, thereby performing the electromagnetic coupling between the dual feeding ports and being usable at multiple frequency bands. Further, a mobile communication apparatus using the multi band chip antenna is disclosed. The multi band chip antenna comprises a first conductive feeding port, a second conductive feeding port, a conductive power-feeding electrode connected to the first feeding port, a conductive loop-type electrode connected to the second feeding port, a conductive radiation electrode electrically connected to the power-feeding electrode, a conductive ground electrode connected to the radiation electrode, and a conductive ground electrode port connected to the ground electrode and the loop-type electrode. The multi band chip antenna of the present invention is miniaturized, and the mobile communication apparatus using the multi band chip antenna does not require a diplexer.

Multi band chip antenna with dual feeding ports, and mobile communication apparatus using the same

Growing community of inventors

Suwon, South Korea

Heung Soo Park