University of Illinois

Gwangju Institute of Science and Technology

X-celeprint Limited

Semprius, Inc.

Northwestern University

Industry-university Cooperation Foundation Sogang University

Heung Cho Ko

John A Rogers

Matthew Alexander Meitl

Etienne Menard

Ralph G Nuzzo

Mark Stoykovich

Jongseung Yoon

Yonggang Huang

Jong-Hyun Ahn

Michael Motala

Chang-Jae Yu

Won Mook Choi

Sang-Il Park

Yugang Sun

Dahl-Young Khang

Zhengtao Zhu

Jong Hyun Ahn

Keon Jae Lee

Hanqing Jiang

Andrew Evert Carlson

Dae Hyeong Kim

Jizhou Song

Young Kyu Hwang

Hun Soo Jang

Su Ok Yun

Shawn Mack

Jongwon Yoon

Seong-Ju Park

Seok Ho Kim

Hyun-A Cho

Byeong-Il Noh

Jaeyi Chun

Hoon-sik Kim

Bongjin Moon

Seong Jun Kang

Seong Gwang Yoo

Seong Hyeon Kang

Yun Kyung Jeong

Gi Gwan Kim

Yun Jeong Heo

Jeong Pil Park

Seonggwang Yoo

Jung Il Yoo

Yeong Min Kim

Suk-ho Kim

Woonghyun Choi

Hoosung Lee

Yujun Hyun

Suk Ho Kim

Youngkyu Hwang

Heeje Kim

Yunkyung Jeong

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

Optical systems fabricated by printing-based assembly

Provided are a three-dimensional electronic device manufactured through a polymer frame solvent-plasticizing process and a method for manufacturing the three-dimensional electronic device including a polymer frame configured to have a planar figure-like shape so as to have a polygonal bottom and adjacent surfaces which are formed to be extended from respective edges of the bottom; and a flexible electronic device which is transferred to the polymer frame. The polymer frame is exposed to organic solvent vapor and has a change in Young's modulus.

Three-dimensional electronic device through organic solvent plasticization process of polymer frame, and method for manufacturing same

A deformation sensing sensor as disclosed includes a conductive material inside the body thereof such that, by sensing a change in resistance or capacitance resulting from a deformation, a degree of deformation of the measurement object can be detected. The body includes an elastic layer, which has a corrugation formed on one surface thereof, and a conductive layer, which is formed on the other surface of the elastic layer using a conductive material. When the body is deformed in the lateral direction of the surface on which the corrugation is formed, the change in resistance of the conductive layer before and after the deformation, or the change in capacitance thereof is measured, thereby detecting the degree of deformation of the measurement object.

Strain sensor with improved sensitivity

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

Stretchable and foldable electronic devices

The present disclosure relates a method for transfer printing of an electronic device comprising: forming a sacrificial layer on a handling substrate; forming a protective layer on the sacrificial layer; forming a polymer substrate on the protective layer; forming a pattern on the polymer substrate, and forming a ciliary adhesive rod on the sides of the polymer substrate; forming a supportive layer on the polymer substrate on which the adhesive rod is formed; and removing the sacrificial layer and the protective layer, and transfer printing the electronic device onto an object to-be-printed, while dissolving the to supportive layer.

Cilia-assisted transfer printing of electronic devices

Disclosed herein is a transfer printing technology. A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. In situ alignment of a transfer layer is performed by the pillar structures and a structural confinement by a concave structure formed on a bottom surface of the transfer layer corresponding to the pillar structures, or a chemical bond of the pillar structure and the transfer layer. In the in situ alignment by the structural confinement, the remaining sacrificial layer after being removed may serve as an adhesive component. The transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemic bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate.

Transfer printing substrate

The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. The present invention allows a process of manufacturing a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.

Method for fabricating transfer printing substrate using concave-convex structure, transfer printing substrate fabricated thereby and application thereof

Provided are methods for making a device or device component by providing a multi layer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

Release strategies for making transferable semiconductor structures, devices and device components

Growing community of inventors

Gwangju, South Korea

Heung Cho Ko