Lg Innotek Co., Ltd.

Heun Gun Shin

Jae Hwa Kim

Chung Sik Park

According to one embodiment, the present invention relates to a printed circuit board, comprising: a first insulating layer; an inner layer circuit pattern disposed on an upper surface of the first insulating layer; a second insulating layer, disposed on the first insulating layer, for covering the inner layer circuit pattern; a first outer layer circuit pattern integrated into a lower surface of the first insulating layer; and a second outer layer circuit pattern embedded in an upper surface of the second insulating layer, the first insulating layer comprising a thermosetting resin, and the second insulating layer comprising a photocurable resin.

Printed circuit board

A printed circuit board according to the embodiment includes an insulating layer; a first pad on a top surface of the insulating layer; a second pad on a bottom surface of the insulating layer; and a via formed in the insulating layer and having one surface connected to the first pad and an opposite surface connected to the second pad, wherein the via includes a plurality of via parts which are at least partially overlapped with each other.

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Seoul, South Korea

Heun Gun Shin