Siemens Aktiengesellschaft

Herrmann Wessely

Wilfried Turk

A printed circuit module comprises a printed circuitboard equipped with integrated modules, a connector part and a contact pressure part exerting a pressure on a printed circuitboard surface, for example, a cooling device. In order to prevent warping or bending of the printed circuitboard due to the contact pressure component or due to plugging and unplugging operations, and from causing line breaks or the like, a counterpressure on the printed circuitboard is generated and a flexible connection is established between the connector part and the printed circuitboard. To this end, contacting elements of the connector part are uniformly, aerially distributed over the printed circuitboard. They respectively comprise a spring shaft for receiving a contact pin and a connecting lug resting against the printed circuitboard in a spring-like manner and whose end adjoining the contact guide surface is designed in the form of a straight metal strip and presses with its end face 3 onto to the contacting surface, and whose other end is connected to the spring shaft via a leaf spring portion bent in a wavy manner.

Printed circuit module

Integrated modules are disposed on a rigid printed circuitboard with the entire rear surface of each module in contact with a common cooling plate. The individual contact pressure of the integrated modules against the cooling plate occurs by way of resilient elements respectively inserted between the printed circuitboard and the modules.

Device for cooling a plurality of integrated modules combined on a rigid

A subrack has a plurality of logic cards disposed in a planar arrangement. The logic cards are surrounded by a plug connector which has a cooling plate. In order to produce a good and uniform thermal contact to a further cooling plate, which is assigned in common to all logic cards, the logic cards are positioned in chambers of a grid frame to which the common cooling member is connected. Each cooling plate is individually pressed against the common cooling plate by way of a releasable connection, such as a screw.

Cooling subrack for logic cards

Integrated modules are disposed on a flexible printed circuitboard. The entire rear surface of each module is in contact with a common cooling plate and the individual contact pressure of the individual integrated modules against the cooling plate occurs by way of resilient elements respectively inserted between the printed circuitboard and the modules.

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Munich, Germany

Herrmann Wessely