Micron Technology Incorporated

Intel Corporation

Ovonyx Memory Technology, LLC

Carlow Innovations LLC

Hernan Adolfo Castro

Jeremy Miles Hirst

Stephen H Tang

Everardo Torres Flores

Stephen W Russell

Fabio Pellizzer

Richard Keith Dodge

William A Melton

Stephen H S Tang

Innocenzo Tortorelli

Kerry Dean Tedrow

Eric S Carman

Mark A Holler

Shanky Kumar Jain

Jack Chinho Wu

Agostino Pirovano

Sean Stephen Eilert

Dmitri A Yudanov

Derchang Kau

Simon M Tam

Brandon Barnett

Gordon D Holt

Wei W Wang

Feng Q Pan

Kiran Pangal

Aswin Thiruvengadam

Handong Li

Davide Mantegazza

Timothy C Langtry

Ameen D Akel

Ilya V Karpov

Balaji Srinivasan

Narayan Sundararajan

Matthew Goldman

Eddie T Flores

Andrea Redaelli

Hari Giduturi

Mark E Bauer

Mattia Boniardi

Narayanan Sundararajan

Ronald G Benson

Everado Torres Flores

Systems, methods, and apparatus related to memory devices that perform multiplication using logical states of memory cells. In one approach, a memory cell array has memory cells programmed to store weights for performing the multiplication. Voltages are applied to the memory cells. Each voltage represents one or more input bits to be multiplied by one of the weights. Output currents from the memory cells are accumulated in a common bitline. A sum of the output currents is digitized to provide a digital result. The digital results from several bitlines can be shifted based on bit significance and added to provide a final accumulation result from the multiplication.

Memory device performing multiplication using logical states of memory cells

Methods and apparatuses for thin film transistors and related fabrication techniques are described. The thin film transistors may access two or more decks of memory cells disposed in a cross-point architecture. The fabrication techniques may use one or more patterns of vias formed at a top layer of a composite stack, which may facilitate building the thin film transistors within the composite stack while using a reduced number of processing steps. Different configurations of the thin film transistors may be built using the fabrication techniques by utilizing different groups of the vias. Further, circuits and components of a memory device (e.g., decoder circuitry, interconnects between aspects of one or more memory arrays) may be constructed using the thin film transistors as described herein along with related via-based fabrication techniques.

Memory array decoding and interconnects

The present disclosure includes apparatuses, methods, and systems for multi-state programming of memory cells. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to program a memory cell of the plurality of memory cells to one of a plurality of possible data states by applying a voltage pulse to the memory cell, determining the memory cell snaps back in response to the applied voltage pulse, turning off a current to the memory cell upon determining the memory cell snaps back, and applying a number of additional voltage pulses to the memory cell after turning off the current to the memory cell.

Multi-state programming of memory cells

Row electrode drivers and column electrode drivers for a memory device are distributed within a footprint share by a memory cell array.

Memory device architecture

Methods, systems, and devices for buried lines and related fabrication techniques are described. An electronic device (e.g., an integrated circuit) may include multiple buried lines at multiple layers of a stack. For example, a first layer of the stack may include multiple buried lines formed based on a pattern of vias formed at an upper layer of the stack. The pattern of vias may be formed in a wide variety of spatial configurations, and may allow for conductive material to be deposited at a buried target layer. In some cases, buried lines may be formed at multiple layers of the stack concurrently.

Buried lines and related fabrication techniques

Methods, apparatuses, and systems for in-or near-memory processing are described. Bits of a first number may be stored on a number of memory elements, wherein each memory element of the number of memory elements intersects a bit line and a word line of a number of word lines. A number of signals corresponding to bits of a second number may be driven on the number of word lines to generate a number of output signals. A value equal to a product of the first number and the second number may be generated based on the number of output signals.

Methods of performing processing-in-memory operations, and related devices and systems

Methods and apparatuses for a cross-point memory array and related fabrication techniques are described. The fabrication techniques described herein may facilitate concurrently building two or more decks of memory cells disposed in a cross-point architecture. Each deck of memory cells may include a plurality of first access lines (e.g., word lines), a plurality of second access lines (e.g., bit lines), and a memory component at each topological intersection of a first access line and a second access line. The fabrication technique may use a pattern of vias formed at a top layer of a composite stack, which may facilitate building a 3D memory array within the composite stack while using a reduced number of processing steps. The fabrication techniques may also be suitable for forming a socket region where the 3D memory array may be coupled with other components of a memory device.

Cross-point memory array with access lines

Spiking events in a spiking neural network may be processed via a memory system. A memory system may store data corresponding to a group of destination neurons. The memory system may, at each time interval of a SNN, pass through data corresponding to a group of pre-synaptic spike events from respective source neurons. The data corresponding to the group of pre-synaptic spike events may be subsequently stored in the memory system.

Performing processing-in-memory operations related to pre-synaptic spike signals, and related methods and systems

Methods, systems, and devices for pulse based multi-level cell programming are described. A memory device may identify an intermediate logic state to store to a multi-level memory cell capable of storing three or more logic states. The memory device may apply a first pulse with a first polarity to the memory cell to store a SET or RESET state to the memory cell based on identifying the intermediate logic state. As such, the memory device may identify a threshold voltage of the memory cell that stores the SET or RESET state. The memory device may apply a quantity of pulses to the memory cell to store the identified intermediate logic state based on identifying the threshold voltage of the memory cell that stores the SET or RESET state. In some examples, the quantity of pulses may have a second polarity different than the first polarity.

Pulse based multi-level cell programming

Methods, apparatuses, and systems for in- or near-memory processing are described. Spiking events in a spiking neural network may be processed via a memory system. A memory system may store a group of destination neurons, and at each time interval in a series of time intervals of a spiking neural network (SNN), pass through a group of pre-synaptic spike events from respective source neurons, wherein the group of pre-synaptic spike events are subsequently stored in memory.

Performing processing-in-memory operations related to spiking events, and related methods, systems and devices

Thin film transistors and related fabrication techniques

The present disclosure includes apparatuses, methods, and systems for three-state programming of memory cells. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to program a memory cell of the plurality of memory cells to one of three possible data states by applying a voltage pulse to the memory cell, determining whether the memory cell snaps back in response to the applied voltage pulse, and applying an additional voltage pulse to the memory cell based on the determination of whether the memory cell snaps back.

Three-state programming of memory cells

Methods, a memory device, and a system are disclosed to reduce power consumption in a cross-point memory device, including providing a first portion of a first pulse of a memory operation to a memory cell at a first time using a first capacitive discharge from a first discharge path, and providing a second portion of the first pulse of the memory operation to the memory cell at a second time, later than the first time, using a second discharge path.

Stored charge use in cross-point memory

Growing community of inventors

Shingle Springs, CA, United States of America

Hernan Adolfo Castro