Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Siltronic Ag

Hermann Zwirglmaier

Hanifi Malcok

Karl Kobler

Josef Berger

Mümmler Frank

A method for monitoring the calibration of and calibrating rotating tools ich are liable to deviate, wherein at least one known deviation is recorded at a first predetermined rotational speed. The method can be used with annular saws that divide workpieces into semiconductor wafers.

Method for calibrating rotating tools

The invention is a method and apparatus for sawing bar-shaped workpieces o slices by means of an annular saw. The saw blade deviation, from its nominal position in the axial direction during the sawing operation, is compensated for. According to the invention, the deviation can be compensated for by the workpiece and the clamping system of the saw blade performing an appropriate relative translatory axial movement in accordance with the measured deviation. This movement is conveniently controlled by a computer, which compares the actual and nominal position of the saw blade with one another. The method can be used especially in the sawing of semiconductor bars.

Method and apparatus for sawing bar-shaped workpieces into slices

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Teising, Germany

Hermann Zwirglmaier