Zf Friedrichshafen Ag

Hermann Josef Robin

Josef Loibl

Thomas Maier

Herbert Wallner

Martin Hempen

Jörg Dittrich

An electronics module for a transmission control unit may including one or more of the following: a printed circuit board populated with electronic components that are attached to an upper surface and/or a lower surface of the printed circuit board, and electrically connected thereto, and a media-tight protective layer, which covers one or more electronic components and connecting points between the one or more electronic components and the printed circuit board, where there is a cooling element for cooling the electronic components on one side of the printed circuit board, where the cooling element is connected to the printed circuit board and houses the electronic components that are to be cooled, and where the media-tight protective layer covers a transition region between the printed circuit board and the cooling element along the entire periphery of the cooling element.

Electronics module for a transmission control unit, and transmission control unit

A transmission may include a housing and also a power electronics module, the power electronics module including a carrier element with at least one power switching element with a cooling surface and also a cooling body, which may be connected in a thermally conductive manner to the cooling surface of the at least one power switching element. The housing may have an oil space for at least partially accommodating transmission components. The power electronics module may be at least partially arranged inside the oil space of the transmission.

Transmission with power electronics module

An electronic module for a transmission control unit may include a printed circuit board that has an electronic component. The electronic component may be electrically connected to a surface of the printed circuit board at least at one point. At least a portion of the electronic component that includes the at least one point may be covered with a protective coating. The protective coating may include a media-tight protective lacquer. The electronic component may be a semiconductor component contained in a housing.

Electronic module for a transmission control unit, and transmission control unit

An electronic module of a control device of a vehicle includes at least one interconnect device, with electronic structural elements as the control unit, and at least one electronic component electrically connected to the interconnect device via a connecting region, wherein the structural elements of the interconnect device and each connecting region between the interconnect device and each dedicated electronic component are coated with an encapsulating material. Furthermore, a method for encapsulating an electronic module is disclosed.

Electronic module and method for encapsulation thereof

The invention relates to an electronic module () mounted on a transmission component (). The electronic module () comprises a printed circuit board element () that has component side () with at least one electronic component () and a contact side () lying opposite the component side (), and a heat conducting film () that is placed between a surface section of the contact side () lying opposite the component () and a surface section of the transmission component (). The printed circuit board element () can be or is tightened to the transmission component () such that the heat conducting film () is pressed against the surface section of the contact side () and the surface section of the transmission component ().

Electronic module for arrangement to a transmission component and a method for arranging an electronic module to a transmission component

The present disclosure provides a method for protecting an electronic interconnect device from environmental effects. The electronic interconnect device may be connected to at least one electronic component, wherein the electronic interconnect device and the at least one electronic component are at least partially covered with an encapsulating material in a material-bonded manner. The method may include applying the encapsulating material to the electronic interconnect device with a 3D printer during a 3D printing process.

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Wuppertal, Germany

Hermann Josef Robin