Siemens Aktiengesellschaft

Hermann Buerk

Kaspar Weingand

Franz Auracher

Michael Stockmann

Rudolf Keil

Karl-Heinz Zeitler

Thomas Wagner

Michael Steinhauser

Hans Schuster-Woldan

Dirk Koch

A method for removing photoresists, particularly those stressed during etching is provided. Pursuant to the method, an electrolysis is performed in order to promote basic decoating bath, wherein the substrate carrying the stressed photoresist structure is wired as a cathode. Gases arising directly at the substrate surface or, respectively, at the exposed metallic surfaces, effect a complete decoating the photoresist structure that at the same time is dissolving in the basic bath.

Method for removing photoresist

An optical device, such as the switch, for controlling the passage of a light beam into and out of an end face of a waveguide such as a glass fiber includes utilizing either a layer or drop of liquid material to control the light passage. The liquid material can be a layer, which has changeable optical properties, which can occur by applying a magnetic field, heat or electrical field or the material can be a layer of electrolyte material which will precipitate a reflective layer or electrochromic layer in response to an application of an electrical field. In another embodiment, the liquid material may be moved into and out of engagement with the end face to change the reflective nature of the end face and to cause decoupling of light from the end face or block the transmission of light.

Optical device or switch for controlling radiation conducted in an

A method for manufacturing unsupported metal lattice structures, such as nickel lattices for use as micro-flow sensors in gas analysis devices, employs the steps of two-sided vacuum metallization on a substrate, several photoresist steps, an electroplating step, and an etching step. A number of units can be produced by this method on a single substrate.

Method for manufacturing unsupported metal lattice structures

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Maisach, Germany

Hermann Buerk