Carl Zeiss Smt Gmbh

Carl-zeiss-smt Ag

Asml Netherlands B.v.

Hermann Bieg

Uy-Liem Nguyen

Stefan Xalter

Yim-Bun Patrick Kwan

Thomas Bischoff

Michael Muehlbeyer

Karl-Eugen Aubele

Marcus Will

Saverio Sanvido

Martin Schmidt

Hans-Juergen Mann

Johannes Hubertus Josephina Moors

Bernhard Gellrich

Dirk Heinrich Ehm

Bastiaan Theodoor Wolschrijn

Stephan Muellender

Willi Heintel

Martin Humphries

Martin Huber

Francois Henzelin

Gerhard Szekely

Yim-Bum Patrick Kwan

A mirror arrangement, in particular for a microlithographic projection exposure apparatus, includes at least one mirror element bearing a mirror surface provided for reflecting electromagnetic radiation, at least one carrier element including a head section, which is provided for receiving at least one mirror element, and also a seat section. The arrangement further includes a mount arrangement, for receiving the at least one carrier element. At least one insertion opening is in the mount arrangement. The seat section of the carrier element plunges into the insertion opening. In addition, the arrangement includes a channel device for guiding a heat transfer medium is formed in the mount arrangement in the region surrounding the seat section. A method for dissipating heat is provided.

Mirror arrangement for microlithographic projection exposure apparatus and related method

A projection exposure apparatus for semiconductor lithography has a mirror arrangement that is exposed to thermal loads in operation. The mirror arrangement includes a mirror carrier having an optically active surface arranged on a top surface of the mirror carrier. A cooling system is integrated into the mirror carrier. The cooling system has cooling lines through which a cooling fluid circulates. The cooling system is designed so that the thermal load introduced into the mirror carrier via the optically active surface is dissipated at least partially into a rear region remote from the top surface of the mirror carrier.

Projection exposure apparatus for semiconductor lithography with reduce thermal deformation

The invention relates to an optical imaging device, in particular an objectivefor microlithography in the field of EUVL for producing semiconductor components, having a beam path, a plurality of optical elementsand a diaphragm devicewith an adjustable diaphragm opening shape. The diaphragm device has a diaphragm storewith a plurality of different diaphragm openingswith fixed shapes in each case, which can be introduced into the beam path

Diaphragm changing device

An optical module includes an aperture device and a support structure supporting the aperture device. The aperture device defines an aperture edge and an aperture plane. The aperture edge is adapted to define a geometry of a light beam passing the aperture device along an optical axis. The support structure is adapted to hold the aperture device in a defined manner when the aperture plane is inclined with respect to a horizontal plane. A temperature distribution prevails within the aperture device and at least one of the aperture device and the support structure is adapted to maintain at least one of a relative position of the aperture edge with respect to the optical axis and a geometry of the aperture edge substantially unaltered upon an introduction of a thermal energy into the aperture device, where the thermal energy being adapted to cause an alteration in the temperature distribution.

Optical aperture device

An optical assembly supported in an arrangement, especially in an objective or in an illuminating or exposure system, in the interior of a housing comprising at least one optical element, especially a lens, a mirror, or an aperture, wherein the at least one element is influenceable by at least one manipulator is characterized in that the at least one manipulator is arranged either outside of the housing or in a holding means that is separated entirely or to a large extent by the help of a decoupling means, and that there is provided an effective coupling between the manipulator and the element to be influenced by the manipulator in the interior of the arrangement.

Optical assembly

An optical imaging device (PL), in particular an objective for semiconductor lithography, is provided with at least one system diaphragm. The system diaphragm comprises a multiplicity of mobile plates, which are rotatably mounted. The plates have a spherical curvature.

Optical imaging device having at least one system diaphragm

An optical system for radiation in the EUV wavelength range, in particular a projection exposure apparatus, having at least one vacuum vessel, including: at least one EUV-reflective optical element arranged in an optical path, and a holder which includes at least one sample element, the sample element having an optical surface which is exposed to incident EUV-radiation outside of the optical path, the sample element being sensitive to chemical alterations under influence of the incident EUV-radiation which also affect the optical element. The optical system further includes at least one detection unit for online detection of the contamination status of the sample element during exposure of the sample element to the incident EUV-radiation.

Optical system for radiation in the EUV-wavelength range and method for measuring a contamination status of EUV-reflective elements

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Huettlingen, Germany

Hermann Bieg