Intel Corporation

Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Nvidia Corporation

Herman W Chu

Rakesh Bhatia

Michael Lawrence Sabotta

Robert H Thomas

Myron R Tuttle

Susheela N Narasimhan

Gwen M Bertolami

Susannah Gardner

Reza Azizian

Eugene Chung

Samuel M S Lee

Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

Configurable heatsink

A method and system of controlling a cooling fan of a computer system including a power supply unit. The method includes sensing a power load of the power supply unit. A reference air temperature of the computer system is also sensed. Finally, a fan setting is determined based upon the sensed power load and the sensed reference air temperature. By basing the fan setting on both reference temperature and actual power supply load, the method and system effectively minimizes cooling fan operation, and thus resulting acoustic noise, when a computer system is operating at less than full capacity. In one preferred embodiment, a look-up table is provided in which a plurality of fan settings are included, each fan setting being based upon a correlation of power supply load and reference temperature. The method and system of the present invention is particularly useful with high-end, server-type computer systems being used for low-end applications, and is readily applied to multiple platforms.

Method and system for controlling a cooling fan within a computer system

The invention consists of a modular apparatus for cooling an integrated circuit chip in a compact computer. The apparatus includes a heat collector assembly operatively connected to the chip, a heat exchange assembly and a heat pipe extending from the heat collector assembly to the heat exchange assembly. The heat exchange assembly includes a primary housing, a fan at one end of the housing, and a secondary housing at the opposite end of the primary housing. The secondary housing has a plurality of fins and the primary housing as a plenum chamber between the fins and the fan. The invention also comprises a high-performance notebook computer and cooling apparatus combination which includes a pivoted outer cover and a cooling system located along the pivoting axis of the outer cover.

High performance notebook PC cooling system

A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.

Heat transfer device for a retention assembly

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Palo Alto, CA, United States of America

Herman W Chu