Quanta Computer Incorporated

Herman Tan

Chao-Jung Chen

Yu-Nien Huang

Tien-Juei Chuang

Chih-Wei Lin

Yung-Hsiang Lu

Chieh-Ling Chang

A nucleate boiling apparatus is disclosed that includes a base configured to fit onto a heat-producing object to provide immersion cooling to the object in a liquid-cooled computing environment. The apparatus further includes first and second pluralities of pipes extending from opposite sides of the base. Each of the first and second pluralities of pipes including a respective transition region and a respective flat region. The first and second pluralities of pipes in the transition regions extend away and up from the base, and the first and second pluralities of pipes in the flat regions extend away from the base in a fanned-out arrangement. The flat region of the second plurality of pipes is at a greater distance from the base than the flat region of the first plurality of pipes.

Nucleate boiling apparatus

An information technology (IT) system is directed to immersion cooling and includes a chassis forming an enclosure between an upstream side and a downstream side. The chassis has a rear opening formed along the downstream side and is configured to receive heat-generating components of the IT system adjacent to the upstream side within the enclosure. The system further includes a supply conduit for delivering an immersion coolant to the upstream side within the enclosure, and a flap mechanism attached to the downstream side near the rear opening. The flap mechanism is movable between an open position and a closed position, which allows accumulated coolant to drain from the chassis in the open position and prevents the accumulated coolant from draining from the chassis in the closed position.

Immersion cooling rack with drain control

A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.

Multi-stage liquid cooling system

A hybrid cooling system is configured to receive heat-generating components of an information technology (IT) device. The system includes a chassis having a peripheral wall that extends between a chassis base and an open top surface, the peripheral wall forming an enclosure between an upstream side and a downstream side. An immersion conduit delivers an immersion coolant and fills the enclosure to fully immerse the heat-generating components. An outlet duct drain overflow of the immersion coolant accumulated in the enclosure. A cold plate within the enclosure is configured for direct contact with at least one heat-generating component. A supply conduit delivers a direct coolant in cooled form within the cold plate, and is in flow communication with a cold plate inlet connector. A return conduit removes the direct coolant in heated form from the cold plate, and is in flow communication with a cold plate outlet connector.

System and method for hybrid direct-to-chip liquid and immersion cooling

A boiling plate including a first surface and a second surface. The first surface provided for contacting a heated component. The second surface is opposite the first surface, and the second surface provided for contacting a liquid medium. The second surface has multiple cone-shaped cavities including a first cone-shaped cavity and a second cone-shaped cavity. A distance between an axis of the first cone-shape cavity and an axis of the second cone-shaped cavity of the multiple cone-shaped cavities are separated by a minimum spacing of four times a radius of the first cone-shaped cavity or the second cone-shaped cavity.

Nucleation surface treatment for thermal cooling

A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

Systems and methods for vapor-compressed cooling

An air duct is disclosed. The air duct includes a housing for directing air over a plurality of slots within a computer system. The housing includes side housing walls and a top housing wall. The side housing walls are respectively connected to opposing ends of the top housing wall. The side housing walls extend in the same direction from the top housing wall. The air duct further includes a plurality of fins extending from the top housing wall in the same direction as the side housing walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is located within the computer system.

Air duct with one or more fins

A fan guard for a fan container includes a housing and a plurality of wings. The housing has a hollow interior defined by a cylindrical inner surface. The housing extends longitudinally between a first housing end and a second housing end. The plurality of wings is positioned within the hollow interior of the housing. Each wing of the plurality of wings extends radially, from a center of symmetry of the cylindrical inner surface to the cylindrical inner surface. Each wing of the plurality of wings is radially curved between the first housing end and the second housing end.

Server fan guard

A device for a computing system is disclosed. The device includes a body, a socket, and a connector. The body includes a panel and an internal conduit. The connector extends from the panel. The connector is removably coupled to the socket. The connector includes an outer end and an inner end. The connector also includes a nut that has an exterior surface mating with a corresponding interior surface of the socket, and a tubular inlet. The connector also has a sleeve with an internal bore and an external surface abutting the tubular inlet of the nut. The internal conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes an angled portion and the sleeve includes a flared portion for assisting in securing the nut and the sleeve in the internal conduit.

Anti-leakage liquid cooling connectors

A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

Cold plate for cooling electronic component

According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

Thermal wake suppressor

A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.

Rack for immersion cooling

A system chassis insertable in a rack is disclosed. The system chassis includes a first end panel. The first end panel includes a first base surface, a first component slot, a first plurality of venting apertures, and a first protrusion. The first base surface has a first portion and a second portion. The first component slot is formed on the first portion of the first base surface. The first component slot is configured to receive a first system component. The first plurality of venting apertures is formed on the first portion of the first base surface and surrounding the first component slot. The first protrusion extends from the second portion of the first base surface. The first protrusion includes a second plurality of venting apertures and a second component slot. The second component slot configured to receive a second system component.

Stepped venting panel

An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.

Front panel air duct

A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.

Growing community of inventors

Taoyuan, Taiwan

Herman Tan