Nortel Networks Corporation

Other

Apple Inc.

Rockstar Consortium US LP

Herman Kwong

Aneta Wyrzykowska

Larry Marcanti

Martin Ridgway Handforth

Richard R Goulette

Kah Ming Soh

Luigi Difilippo

Guy M Duxbury

Rolf Georg Meier

Ryan M Stark

Bryan Parlor

Delfin Y Montuno

Ernst A Munter

Thomas Chmara

Ronald Wellard

Guy M A F Duxbury

Hasler Hayes

Guy A Duxbury

Paul Andrew Senyshyn

Jodee Varney

Eileen Goulet

Robert Hadaway

Aneta O Wyrzykowska

Luigi G Difilippo

Scott B Kuntze

Greg J Clouston

Dieter D Mueller

Stephen Dragan

Leslie J Crane

Van C Au

Pradsad Kodaypak

Bao Chau L Nguyen

Kah-Ming Soh

A mobile backhaul inter-mesh communication point forms an interface between a wireless mesh network on a first level and a wireless mesh network on a second, higher bandwidth, level. The two wireless networks are differentiated, e.g., by causing the mesh networks to be formed using different spectra, protocols or coding, or antennae. The mobile intra-mesh communication point functions as an access point in the lower level mesh network and as a relay point in the upper level mesh network. Utilizing mobile inter-mesh communication points facilitates deployment of wireless network access points while enabling the location of access points to follow the concentration of network users. Mobile inter-mesh communication points may be deployed in personal vehicles such as cars, trucks, and motorcycles, public transportation vehicles such as busses, trains, and aircraft, emergency vehicles such as fire trucks and ambulances, and many other types of vehicles.

Method and apparatus for providing mobile inter-mesh communication points in a multi-level wireless mesh network

Described are a method and system for secure transmission of data through a network. A subcarrier sequence for data transmission is generated. The subcarrier sequence designates at least one subcarrier from a number of orthogonal subcarriers for each of a plurality of intervals in a time sequence. The subcarrier sequence is provided to a receiver. A data signal that includes the subcarriers identified in the subcarrier sequence modulated according to the data is transmitted from a transmitter to the receiver. For additional security, the subcarrier sequence can be transmitted to the receiver using a communications channel that is separate from the communications channel for the data signal. The data signal is detected at the receiver and demodulated according to the subcarrier sequence.

Secure network using orthogonal frequency division multiplexing spread spectrum communications

A technique for improved mapping of the contacts of a PLD to the contacts of one or more other electronic components are provided. In one particular exemplary embodiment, the technique may be realized as a method for mapping contacts of a programmable logic device (PLD) to an electronic component in a signal routing device having one or more layers. The method comprises assigning a set of one or more contacts of the PLD to one or more respective contacts of the electronic component based at least in part on a pattern of electrically conductive traces routed from respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device.

Contact mapping using channel routing

A mobile ad hoc network is formed by selecting at least one client to function as a Virtual Mobile Server ('VMS') on behalf of other clients: Those other clients subsequently communicate with a cell station via the VMS on an UWB format. Other clients may function as Virtual Distributed Mobile Servers ('VDMSs') which relay communications between the VMS and clients which are out of direct communication range of the VMS. Further, multiple VMSs may be implemented for a single ad hoc network in order to bundle bandwidth. Clients may also extend the communication range of the VMS to a new cell station in order to enable earlier initiation of cell station handoff.

Mobile ad hoc network

A technique for enhancing circuit density and performance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for enhancing circuit density and performance of a microelectronic module. The method may comprise forming a discrete package, wherein the discrete package comprises one or more passive devices that are desirable for the performance of the microelectronic module. The method may also comprise coupling the discrete package to the microelectronic module.

Technique for enhancing circuit density and performance

A printed circuit board transmission line has an outer conductive wall surrounding an inner dielectric core. The transmission line may be disposed inside a grounded shielding to provide a form of coaxial conductor that mitigates cross talk from adjacent transmission lines and EMI. Further, groups of dielectric-core transmission lines may be disposed within a single grounded shield. For example, edge coupled differential pairs may be disposed in parallel with each other on a plane defined by a layer of the printed circuit board, i.e., side-by-side. Further, broadside-coupled differential pairs of dielectric-core transmission lines may be disposed in parallel with each other in a stack which is orthogonal with the plane defined by a layer of the printed circuit board, i.e., one on top of the other. Further, a plurality of dielectric-core transmission lines which may include all or ones of single-ended lines and differential pairs may be disposed within a single grounded shield.

Dielectric-filled transmission lines

A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.

Technique for reducing via capacitance

Redundant wireless links in a meshed backhaul network may be used to improve quality of service on the backhaul network by confining knowledge of the duality to the attached network elements. Globally, an aggregate bandwidth of the redundant wireless links may be advertised to allow network level routing to treat the redundant links as a single logical link. At the link level, however, the network elements may differentiate between different types of traffic to provide preferential service to particular types of traffic. By using different physical links within the logical link for particular types of traffic, the quality of service for that type of traffic may be improved by not causing different types of traffic to compete for the same bandwidth. The redundant links may be interfaced using a tower network including a radio accessed router optionally powered using solar power, to isolate the tower network from ground equipment.

Method and apparatus for improving quality of service over meshed bachaul facilities in a wireless network

Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by extending the traces beyond the other layers of the printed wiring board. Corresponding conductors associated with the other device are placed in direct physical contact with the exposed inner layer traces, and may be aligned and secured with guide plates, alignment pins and spring members. Such direct connection mitigates the need for vias, and has more favorable electrical characteristics for high frequency signal transmission.

Signal layer interconnects

Techniques for reducing the number of layers in a multilayer signal routing device are disclosed. The technique may be realized as a method for routing one or more conductive traces between a plurality of electronic components of a multilayer signal routing device. The method comprises forming a first inter-component channel at a first routing layer of the multilayer signal routing device, the first inter-component channel extending between a first set of two or more electronic components of the plurality of electronic components and having a first orientation and forming a second inter-component channel at a second routing layer of the multilayer signal routing device, the second inter-component channel extending between a second set of two or more electronic components of the plurality of electronic components and having a second orientation different from the first orientation.

Technique for routing conductive traces between a plurality of electronic components of a multilayer signal routing device

A technique for improving power/ground flooding is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for improving power and ground flooding in a multilayer circuit board, the multilayer circuit board having a plurality of signal layers. The method may comprise forming a plurality of electrically conductive vias, wherein each of the plurality of electrically conductive vias extends through one or more of the plurality of signal layers. The method may also comprise routing signals associated with the plurality of electrically conductive vias, thereby creating at least one power/ground flooding channel. The method may additionally comprise forming at least one power/ground connection within the at least one power/ground flooding channel.

Technique for improving power and ground flooding

A technique for reducing the number of layers in a multilayer circuit board having a plurality of electrically conductive signal layers for routing electrical signals to and from a surface of the multilayer circuit board is disclosed. The technique is realized by a method comprising: forming a plurality of electrically conductive vias in the multilayer circuit board extending from the surface of the multilayer circuit board to at least one of the plurality of electrically conductive signal layers; arranging the surface such that a first set of two power/ground pins corresponds to a first via and a second set of two power/ground pins corresponds to a second via positioned adjacent the first via, thereby creating a channel; and routing a first plurality of electrical signals through the channel on the first of the plurality of electrically conductive signal layers.

Technique for reducing the number of layers in a multilayer circuit board

Exemplary techniques for tuning the effective capacitance provided by an embedded capacitor are disclosed. The techniques may be realized by modifying one or more conductive features of one or more vias connected to the embedded capacitor to adjust the capacitance contributed by the one or more vias. One technique preferably includes altering the conductive surface area of a pad of one or more vias to which the embedded capacitor is electrically connected to increase or decrease the contributed capacitance. Another technique provides for bore drilling or tap drilling one or more vias connected to the embedded capacitor to increase the surface area of plated interior surfaces of the vias, thereby increasing their capacitive effect. An additional technique includes forming a number of vias having various capacitive effects and electrically connecting the embedded capacitor to one or more of these vias to increase the capacitance.

Growing community of inventors

Kanata, Canada

Herman Kwong