Motorola Corporation

Other

Motorola Solutions, Inc.

Herman J Miller

John M Waldvogel

Billy J Van Cannon

Brian R Bielick

Robert B Widmayer

Sandra L Miller

The knot-tying tool is a device that is used to assist in tying knots. The knot-tying tool is adapted for use with monofilament line. The knot-tying tool is further adapted for use with fishing hooks. The knot-tying tool includes a hook holder and a knotting post. The hook holder holds a fishing hook or a swivel such that a fishing line can be threaded through the fishing hook or swivel. The knotting post is a shaft around which the fishing line can be looped so as to assist in tying the knot attaching the fishing line to the fishing hook or swivel. The knot-tying tool includes a handle, a hook holder, a sleeve, and a knotting post.

Knot-tying tool

In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.

Radio frequency transistor and matching circuit grounding and thermal management apparatus

A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Electrical circuit apparatus and method for assembling same

Base radio module

An electrical circuit apparatus () that includes: a substrate () having a ground layer (), at least one thermal aperture (), and at least one solder aperture (); a heat sink (); and an adhesive layer () for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture () and at least one solder aperture (), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Electrical circuit apparatus and methods for assembling same

An electrical circuit apparatus () that includes: a substrate () having a ground layer (), at least one device aperture (), and at least one solder aperture (); a heat sink (); and an adhesive layer () for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Growing community of inventors

Algonquin, IL, United States of America

Herman J Miller