Veeco Precision Surface Processing LLC

Solid State Equipment Corp.

Exxon Research and Engineering Company

Herman Itzkowitz

William Gilbert Breingan

James K Anders

Ray Regan

A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer. By spinning this outer ring at high speed, centrifugal force causes these drops to be pulled off of the wafer and flung radially outward, thus preventing the liquid from affecting the backside of the wafer.

Apparatus for dual speed spin chuck

The collection chamber apparatus acts to separate multiple fluids during the wafer processing cycle. Round, fluid collection trays surround the round wafer to collect each individual fluid, recycling them for later reuse. The trays move up and down by use of air cylinders and stack into each other to prevent cross contamination of the other fluids. Two opposing pistons (air cylinders) lift the trays in pairs to form fluid collection chambers. Each collection chamber has a unique drain which enters a separation manifold, flowing into separate tanks for later reuse.

Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle

The invention provides an apparatus and method for cleaning or etching wafers. The invention further provides a megasonic transducer designed to apply mechanical vibrations to a layer of fluid in contact with a wafer. The electromechanical transducer is housed in a quartz or sapphire lens which is chemically compatible with the layer of fluid, and sealed to protect the housing interior from fluids and chemical fumes. An electrical power source produces a signal that is sent to the transducer to generate a megasonic wave. The wave travels between the lens and the wafer, through the layer of fluid, dislodging small particles from the wafer which are then removed in the fluid stream. In one embodiment of the present invention, a wafer to be cleaned is placed on a rotatable support below a transducer assembly. A fluid is introduced through the transducer assembly to provide a layer of fluid between the lens and wafer. In a wafer etch application, the megasonic energy is used to enhance the etch rate on the surface of the wafer.

Megasonic treatment apparatus

A wafer scrubbing device for cleaning the surfaces of a thin disk disposed on a stationary spin chuck employs a double brush arrangement whereby brush rotation induces rotation of the disk to be cleaned and whereby the speed differential between the constant rotational speed of the brushes and the variable rotational speed of the disk due to the relative position of the brushes on the disk causes the scrubbing of both surfaces and the edge of the disk.

Wafer scrubbing device

A motor control system for driving a stepper motor and a typewriter or the like is provided, the control including reliable means for tracking incremental movements of the stepper and the element being driven by the stepper. Phase combinations of the stepper motor are energized as a function of tracked position, in a manner which optimizes movement from a present position to a target position. Present position is tracked by generating a pair of sensor signals and converting same to digital signals, which digital signals are constrained to change in accordance with the predetermined pattern on a step by step or increment by increment basis. If the pattern is not followed precisely the error is detected and a correction in position information can be made.

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Bala Cynwyd, PA, United States of America

Herman Itzkowitz