Semsysco Gmbh

Herbert Ötzlinger

Andreas Gleissner

Thomas Wirnsberger

Oliver Knoll

Raoul Schröder

Franz Markut

Georg Hofer

Harald Okorn-schmidt

Ulrich Tschinderle

Thomas Wimsberger

Markus Gersdorff

Louis Wagner

Marianne Kolitsch-mataln

The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.

Substrate holding and locking system for chemical and/or electrolytic surface treatment

The invention relates to a module for chemically processing a substrate, a method for chemically processing a substrate and a use of a module for chemically processing a substrate and in particular a large substrate. The module for chemically processing a substrate comprises: an immersion chamber, a spray unit, and a motion unit (). The immersion chamber is configured to receive a first liquid and the substrate, so that the substrate is immersed in the liquid. The spray unit comprises a plurality of spray nozzles, which are configured to spray a second liquid within the immersion chamber. The motion unit is configured to provide a relative motion between the substrate and the spray unit.

Module for chemically processing a substrate

Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.

Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment

An exemplary distribution system, apparatus and method can be provide for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The distribution system can comprise a distribution body and a control unit. The distribution body can be configured to direct a flow of the process fluid and/or an electrical current to the substrate. The distribution body can comprise at least a first distribution element and a second distribution element. The control unit/device can be configured to control the first distribution element and the second distribution element separately from one another.

Distribution system for chemical and/or electrolytic surface treatment

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Hallwang, Austria

Herbert Ötzlinger